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1 |
Effect of Residual Oxygen in a Vacuum Chamber on the Deposition of Cubic Boron Nitride Thin Film
Oh, Seung-Keun;Kim, Youngman;
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The Korean Institute of Surface Engineering
, v.46, no.4, pp.139-144,
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2 |
Growth of Nanocrystalline Diamond on W and Ti Films
Park, Dong-Bae;Myung, Jae-Woo;Na, Bong-Kwon;Kang, Chan Hyoung;
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The Korean Institute of Surface Engineering
, v.46, no.4, pp.145-152,
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3 |
A study on the Additive Decomposition Generated during the Via-Filling Process
Lee, Min Hyeong;Cho, Jin Ki;
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The Korean Institute of Surface Engineering
, v.46, no.4, pp.153-157,
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4 |
Effects of Chloride Ion on Accelerator and Inhibitor during the Electrolytic Cu Via-Filling Plating
Yu, Hyun-Chul;Cho, Jin-Ki;
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The Korean Institute of Surface Engineering
, v.46, no.4, pp.158-161,
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5 |
Temperature Distribution According to the Structure of a Conductive Layer during Joule-heating Induced Encapsulation for Fabrication of OLED Devices
Jang, Ingoo;Ro, Jae-Sang;
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The Korean Institute of Surface Engineering
, v.46, no.4, pp.162-167,
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6 |
Anti-corrosion Properties of CrN Thin Films Deposited by Inductively Coupled Plasma Assisted Sputter Sublimation for PEMFC Bipolar Plates
You, Younggoon;Joo, Junghoon;
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The Korean Institute of Surface Engineering
, v.46, no.4, pp.168-174,
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7 |
Effect of the Ni Catalyst Size and Shape on the Variation of the Geometries for the As-grown Carbon Coils
Jang, Chang-Young;Kim, Sung-Hoon;
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The Korean Institute of Surface Engineering
, v.46, no.4, pp.175-180,
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