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| 1 |
Improvement of Reliability of Low-melting Temperature Sn-Bi Solder
Jeong, Min-Seong;Kim, Hyeon-Tae;Yoon, Jeong-Won;
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The Korean Microelectronics and Packaging Society
, v.29, no.2, pp.1-10,
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| 2 |
Trends of Low-temperature Bonding Technologies using Gallium and Gallium Alloys
Hong, Teayeong;Shim, Horyul;Sohn, Yoonchul;
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The Korean Microelectronics and Packaging Society
, v.29, no.2, pp.11-18,
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| 3 |
Thermoreflectance Microscopy for Thermal Analysis of Electronics
Kim, Hyeon-Beom;Lee, Seunghwan;Jang, Hyejin;
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The Korean Microelectronics and Packaging Society
, v.29, no.2, pp.19-31,
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| 4 |
Soft Interconnection Technologies in Flexible Electronics
Lee, Woo-Jin;Lee, Seung-Min;Kang, Seung-Kyun;
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The Korean Microelectronics and Packaging Society
, v.29, no.2, pp.33-41,
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| 5 |
Effects of Temperature/Humidity Treatment Conditions on the Peel Strength between Screen-printed Ag and Polyimide Films
Lee, Hyeonchul;Bae, Byeong-Hyun;Son, Kirak;Kim, Gahui;Park, Young-Bae;
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The Korean Microelectronics and Packaging Society
, v.29, no.2, pp.43-48,
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| 6 |
A Study on Flux Immunity MUF for Improving Flip Chip PKG Reliability
Lee, Junshin;Lee, Hyunsuk;Kim, Minseok;Kim, Sungsu;Moon, Kiill;
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The Korean Microelectronics and Packaging Society
, v.29, no.2, pp.49-52,
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| 7 |
Resistive Switching Properties of N and F co-doped ZnO
Kim, Minjae;Kang, Kyung-Mun;Wang, Yue;Chabungbam, Akendra Singh;Kim, Dong-eun;Kim, Hyung Nam;Park, Hyung-Ho;
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The Korean Microelectronics and Packaging Society
, v.29, no.2, pp.53-58,
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| 8 |
Effects of Film Stack Structure and Peeling Rate on the Peel Strength of Screen-printed Ag/Polyimide
Lee, Hyeonchul;Bae, Byeong-Hyun;Son, Kirak;Kim, Gahui;Park, Young-Bae;
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The Korean Microelectronics and Packaging Society
, v.29, no.2, pp.59-64,
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| 9 |
A Study on the Low Depth Marking Method through Laser Source Characteristic Analysis
Jeon, Sooho;Kim, Jeho;Lee, Youngbeom;Moon, Kiill;
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The Korean Microelectronics and Packaging Society
, v.29, no.2, pp.65-71,
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| 10 |
Study on the Interfacial Reactions between Gallium and Cu/Au Multi-layer Metallization
Bae, Junhyuk;Sohn, Yoonchul;
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The Korean Microelectronics and Packaging Society
, v.29, no.2, pp.73-79,
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| 11 |
Non-conductive Film Effect on Ni-Sn Intermetallic Compounds Growth Kinetics of Cu/Ni/Sn-2.5Ag Microbump during Annealing and Current Stressing
Kim, Gahui;Ryu, Hyodong;Kwon, Woobin;Son, Kirak;Park, Young-Bae;
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The Korean Microelectronics and Packaging Society
, v.29, no.2, pp.81-89,
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| 12 |
Effects of Solder Particle Size on Rheology and Printing Properties of Solder Paste
Jun, So-Yeon;Lee, Tae-Young;Park, So-Jeong;Lee, Jonghun;Yoo, Sehoon;
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The Korean Microelectronics and Packaging Society
, v.29, no.2, pp.91-97,
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| 13 |
Low-k Polymer Composite Ink Applied to Transmission Line
Nam, Hyun Jin;Jung, Jae-Woong;Seo, Deokjin;Kim, Jisoo;Ryu, Jong-In;Park, Se-Hoon;
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The Korean Microelectronics and Packaging Society
, v.29, no.2, pp.99-105,
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| 14 |
Development of Solvent-Free Type for UV-Curable Silver Paste
Jang, Min Yong;Nam, Hyun Jin;Nam, Su Yong;
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The Korean Microelectronics and Packaging Society
, v.29, no.2, pp.107-112,
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| 15 |
Laser Transmission Welding of Flexible Substrates and Evaluation of the Mechanical Properties
Ko, Myeong-Jun;Sohn, Minjeong;Kim, Min-Su;Na, Jeehoo;Ju, Byeong-Kwon;Park, Young-Bae;Lee, Tae-Ik;
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The Korean Microelectronics and Packaging Society
, v.29, no.2, pp.113-119,
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| 16 |
Micro-LED Mass Transfer using a Vacuum Chuck
Kim, Injoo;Kim, Yonghwa;Cho, Younghak;Kim, Sungdong;
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The Korean Microelectronics and Packaging Society
, v.29, no.2, pp.121-127,
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| 17 |
오류정정
한국마이크로전자및패키징학회;
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The Korean Microelectronics and Packaging Society
, v.29, no.2, pp.129-130,
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