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| 1 |
Research Trends of Carbon Composite Film with Electromagnetic Interference Shielding and High Heat Dissipation
Park, Seong-Hyun;Kim, Myounghun;Kim, Kwang-Seok;
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The Korean Microelectronics and Packaging Society
, v.28, no.4, pp.1-10,
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| 2 |
Fabrication of a Novel Ultra Low Temperature Co-fired Ceramic (ULTCC) Using BaV2O6 and BaWO4
Kim, Duwon;Lee, Kyoungho;
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The Korean Microelectronics and Packaging Society
, v.28, no.4, pp.11-18,
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| 3 |
Statistical Approach to 3-Dimensional Shape Inspection of Micro Solder Balls
Kim, Jee Hong;
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The Korean Microelectronics and Packaging Society
, v.28, no.4, pp.19-23,
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| 4 |
Characterization of Alpha-Ga2O3 Epilayers Grown on Ni-Pd and Carbon-Nanotube Based Nanoalloys via Halide Vapor Phase Epitaxy
Cha, An-Na;Lee, Gieop;Kim, Hyunggu;Seong, Chaewon;Bae, Hyojung;Rho, Hokyun;Burungale, Vishal Vilas;Ha, Jun-Seok;
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The Korean Microelectronics and Packaging Society
, v.28, no.4, pp.25-29,
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| 5 |
A Study on Robust Design of PCB for Package on Package by Numerical Analysis with Unit and Substrate Level to Reduce Warpage
Cho, Seunghyun;Kim, Yun Tae;Ko, Young Bae;
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The Korean Microelectronics and Packaging Society
, v.28, no.4, pp.31-39,
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| 6 |
A Study on the Resistve Switching Characteristic of Parallel Memristive Circuit of Lithium Ion Based Memristor and Capacitor
Kang, Seung Hyun;Lee, Hong-Sub;
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The Korean Microelectronics and Packaging Society
, v.28, no.4, pp.41-45,
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| 7 |
Deformation Analysis of Roll Mold for Nano-flexible Devices
Khaliq, Amin;Tahir, Usama;Jeong, Myung Yung;
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The Korean Microelectronics and Packaging Society
, v.28, no.4, pp.47-50,
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| 8 |
Fine Flow Controlling Device for Medicine Injection
Cho, Su-Chan;Shin, Bo-Sung;
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The Korean Microelectronics and Packaging Society
, v.28, no.4, pp.51-55,
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| 9 |
Formation of Indium Bumps on Micro-pillar Structures through BCB Planarization
Park, Min-Su;
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The Korean Microelectronics and Packaging Society
, v.28, no.4, pp.57-61,
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| 10 |
Study of IoT Module Package Design Optimization for Drop Testing by Drone
Jo, Eunsol;Kim, Gu-Sung;
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The Korean Microelectronics and Packaging Society
, v.28, no.4, pp.63-67,
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| 11 |
A Study on the Characteristics of a Quantum Dots Light-Emitting Diodes Using a Mixed Layer of Quantum Dots and Hole Transport Materials
Yoon, Changgi;Oh, Seongkeun;Kim, Jiwan;
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The Korean Microelectronics and Packaging Society
, v.28, no.4, pp.69-72,
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| 12 |
Flexible Carbon/PDMS Composite for the Application of Sensor
Lee, Junho;Park, Kyoung Ryeol;Mhin, Sungwook;
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The Korean Microelectronics and Packaging Society
, v.28, no.4, pp.73-77,
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| 13 |
Effect of the Surfactant Concentration on the Formation of Water Glass-based Porous Hollow Silica Microsphere
Lee, Jihun;Kim, Younghun;Kim, Taehee;Park, Hyung-Ho;
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The Korean Microelectronics and Packaging Society
, v.28, no.4, pp.79-83,
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| 14 |
p-Type Activation of AlGaN-based UV-C Light-Emitting Diodes by Hydrogen Removal using Electrochemical Potentiostatic Activation
Lee, Koh Eun;Choi, Rak Jun;Kumar, Chandra Mohan Manoj;Kang, Hyunwoong;Cho, Jaehee;Lee, June Key;
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The Korean Microelectronics and Packaging Society
, v.28, no.4, pp.85-89,
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| 15 |
Enhanced Thermoelectric Properties in n-Type Bi2Te3 using Control of Grain Size
Lee, Nayoung;Ye, Sungwook;Jamil Ur, Rahman;Tak, Jang-Yeul;Cho, Jung Young;Seo, Won Seon;Shin, Weon Ho;Nam, Woo Hyun;Roh, Jong Wook;
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The Korean Microelectronics and Packaging Society
, v.28, no.4, pp.91-96,
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| 16 |
Insertion Loss Analysis According to the Structural Variant of Interposer
Park, Jung-Rae;Jung, Cheong-Ha;Kim, Gu-Sung;
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The Korean Microelectronics and Packaging Society
, v.28, no.4, pp.97-101,
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| 17 |
Control of Weighted Mobility Ratio to Enhance the Performance of Bi-Te-based Thermoelectric Materials
Kim, Min Young;Kim, Hyun-Sik;Lee, Kyu Hyoung;
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The Korean Microelectronics and Packaging Society
, v.28, no.4, pp.103-107,
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| 18 |
H2 Plasma Pre-treatment for Low Temperature Cu-Cu Bonding
Choi, Donghoon;Han, Seungeun;Chu, Hyeok-Jin;Kim, Injoo;Kim, Sungdong;
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The Korean Microelectronics and Packaging Society
, v.28, no.4, pp.109-114,
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| 19 |
오류정정
한국마이크로전자및패키징학회;
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The Korean Microelectronics and Packaging Society
, v.28, no.4, pp.115-115,
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