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| 1 |
3D Printed Electronics Research Trend
Park, Yea-Seol;Lee Ju-Yong;Kang, Seung-Kyun;
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The Korean Microelectronics and Packaging Society
, v.28, no.2, pp.1-12,
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| 2 |
Transient Electronics and Biodegradable Encapsulation Technologies
Moon, Joon Min;Kang, Seung-Kyun;
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The Korean Microelectronics and Packaging Society
, v.28, no.2, pp.13-28,
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| 3 |
Effects of Ar/N2 Two-step Plasma Treatment on the Quantitative Interfacial Adhesion Energy of Low-Temperature Cu-Cu Bonding Interface
Choi, Seonghun;Kim, Gahui;Seo, Hankyeol;Kim, Sarah Eunkyung;Park, Young-Bae;
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The Korean Microelectronics and Packaging Society
, v.28, no.2, pp.29-37,
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| 4 |
Comparison of Band Pass Filter Performance Using Liquid Crystal Polymer Substrate in Millimeter-Wave Band
Oh, Yeonjeong;Lee, Jaeyoung;Choi, Sehwan;
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The Korean Microelectronics and Packaging Society
, v.28, no.2, pp.39-44,
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| 5 |
A Study on Low Residue Flux for Improving Flip Chip Non-wet and Reliability
Lee, Hyunsuk;Kim, Minseok;Kim, Taehoon;Moon, Kiill;
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The Korean Microelectronics and Packaging Society
, v.28, no.2, pp.45-50,
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| 6 |
Study on the Thermomechanical Properties of Epoxy-Silica Nanocomposites by FTIR Molecular Structure Analyses
Jang, SeoHyun;Han, Yusu;Hwang, DoSoon;Jung, Juwon;Kim, YeongKook;
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The Korean Microelectronics and Packaging Society
, v.28, no.2, pp.51-57,
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| 7 |
Effect of Ag Nanolayer in Low Temperature Cu/Ag-Ag/Cu Bonding
Kim, Yoonho;Park, Seungmin;Kim, Sarah Eunkyung;
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The Korean Microelectronics and Packaging Society
, v.28, no.2, pp.59-64,
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| 8 |
Interfacial and Mechanical Properties of Sn-57Bi-1Ag Solder Joint with Various Conditions of a Laser Bonding Process
Ahn, Byeongjin;Cheon, Gyeong-Yeong;Kim, Jahyeon;Kim, Jungsoo;Kim, Min-Su;Yoo, Sehoon;Park, Young-Bae;Ko, Yong-Ho;
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The Korean Microelectronics and Packaging Society
, v.28, no.2, pp.65-70,
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| 9 |
Transient Liquid Phase Sinter Bonding with Tin-Nickel Micro-sized Powders for EV Power Module Applications
Yoon, Jeong-Won;Jeong, So-Eun;
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The Korean Microelectronics and Packaging Society
, v.28, no.2, pp.71-79,
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| 10 |
Implementation of Passive Elements Applied LTCC Substrate for 24-GHz Frequency Band
Lee, Jiyeon;Ryu, Jongin;Choi, Sehwan;Lee, Jaeyoung;
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The Korean Microelectronics and Packaging Society
, v.28, no.2, pp.81-88,
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| 11 |
Room-temperature Bonding and Mechanical Characterization of Polymer Substrates using Microwave Heating of Carbon Nanotubes
Sohn, Minjeong;Kim, Min-Su;Ju, Byeong-Kwon;Lee, Tae-Ik;
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The Korean Microelectronics and Packaging Society
, v.28, no.2, pp.89-94,
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| 12 |
Mechanical Properties and Interfacial Reactions of Ru Nanoparticles Added Sn-58Bi Solder Joints
Kim, Byungwoo;Choi, Hyeokgi;Jeon, Hyewon;Lee, Doyeong;Sohn, Yoonchul;
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The Korean Microelectronics and Packaging Society
, v.28, no.2, pp.95-103,
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