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| 1 |
Laser Micro Soldering and Soldering Factors
Hwang, Seung Jun;Hwang, Sung Vin;Jung, Jae Pil;
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The Korean Microelectronics and Packaging Society
, v.27, no.3, pp.1-8,
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| 2 |
Nanofilm Transfer Methods and Interfacial Fracture Mechanics
Kang, Sumin;Kim, Taek-Soo;
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The Korean Microelectronics and Packaging Society
, v.27, no.3, pp.9-19,
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| 3 |
Trend of Packaging Technology for Floating Photovoltaics
Choi, Su Bin;Kim, Myounghun;Kim, Kwang-Seok;
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The Korean Microelectronics and Packaging Society
, v.27, no.3, pp.21-27,
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| 4 |
Brittle Fracture Behavior of ENIG/Sn-Ag-Cu Solder Joint with pH of Ni-P Electroless Plating Solution
Seo, Wonil;Lee, Tae-Ik;Kim, Young-Ho;Yoo, Sehoon;
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The Korean Microelectronics and Packaging Society
, v.27, no.3, pp.29-34,
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| 5 |
A Study on the Nonwet Defective Factors of the SMT Process
Yun, Chanhyung;
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The Korean Microelectronics and Packaging Society
, v.27, no.3, pp.35-39,
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| 6 |
Effect of Co Interlayer on the Interfacial Reliability of SiNx/Co/Cu Thin Film Structure for Advanced Cu Interconnects
Lee, Hyeonchul;Jeong, Minsu;Kim, Gahui;Son, Kirak;Park, Young-Bae;
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The Korean Microelectronics and Packaging Society
, v.27, no.3, pp.41-47,
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| 7 |
Development of Epoxy Based Stretchable Conductive Adhesive
Nam, Hyun Jin;Lim, Ji Yeon;Lee, Chang Hoon;Park, Se-Hoon;
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The Korean Microelectronics and Packaging Society
, v.27, no.3, pp.49-54,
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| 8 |
Bonding Strength Evaluation of Copper Bonding Using Copper Nitride Layer
Seo, Hankyeol;Park, Haesung;Kim, Gahui;Park, Young-Bae;Kim, Sarah Eunkyung;
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The Korean Microelectronics and Packaging Society
, v.27, no.3, pp.55-60,
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| 9 |
Study on Design Parameters of Substrate for PoP to Reduce Warpage Using Finite Element Method
Cho, Seunghyun;Lee, Sangsoo;
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The Korean Microelectronics and Packaging Society
, v.27, no.3, pp.61-67,
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| 10 |
A Comparison Study on Quantum Dots Light Emitting Diodes Using SnO2 and TiO2 Nanoparticles as Solution Processed Double Electron Transport Layers
Shin, Seungchul;Kim, Suhyeon;Jang, Seunghun;Kim, Jiwan;
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The Korean Microelectronics and Packaging Society
, v.27, no.3, pp.69-72,
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| 11 |
A Novel Patterning Method for Silver Nanowire-based Transparent Electrode using UV-Curable Adhesive Tape
Ju, Yun Hee;Shin, Yoo Bin;Kim, Jong-Woong;
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The Korean Microelectronics and Packaging Society
, v.27, no.3, pp.73-76,
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| 12 |
Measurement of Mechanical Properties of Thin Film Materials for Flexible Displays
Oh, Seung Jin;Ma, Boo Soo;Kim, Hyeong Jun;Yang, Chanhee;Kim, Taek-Soo;
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The Korean Microelectronics and Packaging Society
, v.27, no.3, pp.77-81,
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| 13 |
Elastic Properties Evaluation of Thin Films on Flexible Substrates with Consideration of Contact Morphology in Nanoindentation
Kim, Won Jun;Hwang, Gyeong-Seok;Kim, Ju-Young;Kim, Young-Cheon;
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The Korean Microelectronics and Packaging Society
, v.27, no.3, pp.83-88,
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| 14 |
Thermal Warpage Behavior of Single-Side Polished Silicon Wafers
Kim, Junmo;Gu, Chang-Yeon;Kim, Taek-Soo;
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The Korean Microelectronics and Packaging Society
, v.27, no.3, pp.89-93,
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| 15 |
오류정정
한국마이크로전자및패키징학회;
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The Korean Microelectronics and Packaging Society
, v.27, no.3, pp.95-95,
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