|
| 1 |
Recent Technology Trends and Future Prospects for Image Sensor
Park, Sangsik;Shin, Bhumjae;Uh, Hyungsoo;
/
The Korean Microelectronics and Packaging Society
, v.27, no.2, pp.1-10,
|
|
| 2 |
Ag-functionalized SnO2 Nanowires Based Sensor for NO2 Detection at Low Operating Temperature
Choi, Myung Sik;Kim, Min Young;Ahn, Jihye;Choi, Seung Joon;Lee, Kyu Hyoung;
/
The Korean Microelectronics and Packaging Society
, v.27, no.2, pp.11-17,
|
|
| 3 |
Mechanical Modeling of Rollable OLED Display Apparatus Considering Spring Component
Ma, Boo Soo;Jo, Woosung;Kim, Wansun;Kim, Taek-Soo;
/
The Korean Microelectronics and Packaging Society
, v.27, no.2, pp.19-26,
|
|
| 4 |
Enhancement in the Textural Properties and Hydrophobicity of Tetraethoxysilane-based Silica Aerogels by Phenyl Surface Modification
Dhavale, Rushikesh P.;Parale, Vinayak G.;Kim, Taehee;Choi, Haryeong;Kim, Younghun;Lee, Kyu-Yeon;Jung, Hae-Noo-Ree;Park, Hyung-Ho;
/
The Korean Microelectronics and Packaging Society
, v.27, no.2, pp.27-32,
|
|
| 5 |
Photoelectrochemical Properties of Gallium Nitride (GaN) Photoelectrode Using Cobalt-phosphate (Co-pi) as Oxygen Evolution Catalyst
Seong, Chaewon;Bae, Hyojung;Burungale, Vishal Vilas;Ha, Jun-Seok;
/
The Korean Microelectronics and Packaging Society
, v.27, no.2, pp.33-38,
|
|
| 6 |
CNT-Ni-Fabric Flexible Substrate with High Mechanical and Electrical Properties for Next-generation Wearable Devices
Kim, Hyung Gu;Rho, Ho Kyun;Cha, Anna;Lee, Min Jung;Ha, Jun-Seok;
/
The Korean Microelectronics and Packaging Society
, v.27, no.2, pp.39-44,
|
|
| 7 |
Mechanical Fatigue Lifetime of Metal Electrode for Flexible Electronics under High Temperature and High Humidity Condition
Kown, Yong-Wook;Kim, Byoung-Joon;
/
The Korean Microelectronics and Packaging Society
, v.27, no.2, pp.45-51,
|
|
| 8 |
A Study on Technology Trend of Power Semiconductor Packaging using Topic model
Park, Keunseo;Choi, Gyunghyun;
/
The Korean Microelectronics and Packaging Society
, v.27, no.2, pp.53-58,
|
|
| 9 |
오류정정
한국마이크로전자및패키징학회;
/
The Korean Microelectronics and Packaging Society
, v.27, no.2, pp.59-64,
|
|