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| 1 |
High-temperature Semiconductor Bonding using Backside Metallization with Ag/Sn/Ag Sandwich Structure
Choi, Jinseok;An, Sung Jin;
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The Korean Microelectronics and Packaging Society
, v.27, no.1, pp.1-7,
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| 2 |
Review on Electric-field Transparent Conduct Electrodes Based on Nanomaterials
Lee, Jae Hyung;Shin, Jae Hyeok;Lee, Sang Il;Park, Won Il;
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The Korean Microelectronics and Packaging Society
, v.27, no.1, pp.9-15,
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| 3 |
Cu-SiO2 Hybrid Bonding
Seo, Hankyeol;Park, Haesung;Kim, Sarah Eunkyung;
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The Korean Microelectronics and Packaging Society
, v.27, no.1, pp.17-24,
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| 4 |
Resistive Switching Characteristic of Direct-patternable Amorphous TiOx Film by Photochemical Metal-organic Deposition
Hwang, Yun-Kyeong;Lee, Woo-Young;Lee, Se-Jin;Lee, Hong-Sub;
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The Korean Microelectronics and Packaging Society
, v.27, no.1, pp.25-29,
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| 5 |
Resistive Switching Characteristic of ZnO Memtransistor Device by a Proton Doping Effect
Son, Ki-Hoon;Kang, Kyung-Mun;Park, Hyung-Ho;Lee, Hong-Sub;
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The Korean Microelectronics and Packaging Society
, v.27, no.1, pp.31-35,
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| 6 |
Effects of O2 Plasma Pre-treatment and Post-annealing Conditions on the Interfacial Adhesion Between Ti Thin Film and WPR Dielectric
Kim, Gahui;Lee, Jina;Park, Se-hoon;Park, Young-Bae;
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The Korean Microelectronics and Packaging Society
, v.27, no.1, pp.37-43,
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| 7 |
Experimental and Numerical Analysis of Microvia Reliability for SLP (Substrate Like PCB)
Cho, Youngmin;Choa, Sung-Hoon;
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The Korean Microelectronics and Packaging Society
, v.27, no.1, pp.45-54,
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| 8 |
Experimental and Numerical Analysis of Package and Solder Ball Crack Reliability using Solid Epoxy Material
Cho, Youngmin;Choa, Sung-Hoon;
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The Korean Microelectronics and Packaging Society
, v.27, no.1, pp.55-65,
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| 9 |
Study on Behavior Characteristics of Embedded PCB for FCCSP Using Numerical Analysis
Cho, Seunghyun;Lee, Sangsoo;
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The Korean Microelectronics and Packaging Society
, v.27, no.1, pp.67-73,
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| 10 |
오류정정
한국마이크로전자및패키징학회;
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The Korean Microelectronics and Packaging Society
, v.27, no.1, pp.75-89,
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