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| 1 |
Al-Cu Electrode Laser Welding for Rechargeable Battery
Hwang, Seung Jun;Kim, Tae Wan;Jeon, Wook Sang;Jung, Jae Pil;
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The Korean Microelectronics and Packaging Society
, v.26, no.4, pp.1-6,
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| 2 |
TLP and Wire Bonding for Power Module
Kang, Hyejun;Jung, Jaepil;
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The Korean Microelectronics and Packaging Society
, v.26, no.4, pp.7-13,
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| 3 |
Technical Trends of Metal Nanowire-Based Electrode
Shin, Yoo Bin;Ju, Yun Hee;Kim, Jong-Woong;
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The Korean Microelectronics and Packaging Society
, v.26, no.4, pp.15-22,
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| 4 |
Numerical Analysis of Thermal Deformation of a PCB for Semiconductor Package at Panel, Strip and Unit Levels
Cho, Seunghyun;Ko, Youngbae;
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The Korean Microelectronics and Packaging Society
, v.26, no.4, pp.23-31,
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| 5 |
A Study on Thermal Properties of Epoxy Composites with Hybrid Fillers
Lee, Seungmin;Rho, Hokyun;Lee, Sang Hyun;
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The Korean Microelectronics and Packaging Society
, v.26, no.4, pp.33-37,
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| 6 |
Analysis on Effective Elastic Modulus and Deformation Behavior of a Stiffness-Gradient Stretchable Electronic Package with the Island-Bridge Structure
Oh, Tae Sung;
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The Korean Microelectronics and Packaging Society
, v.26, no.4, pp.39-46,
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| 7 |
Stretchable Deformation-Resistance Characteristics of the Stiffness-Gradient Stretchable Electronic Packages Based on PDMS
Park, Dae Ung;Oh, Tae Sung;
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The Korean Microelectronics and Packaging Society
, v.26, no.4, pp.47-53,
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| 8 |
Elastic Properties and Repeated Deformation Reliabilities of Stiffness-Gradient Stretchable Electronic Packages
Han, Kee Sun;Oh, Tae Sung;
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The Korean Microelectronics and Packaging Society
, v.26, no.4, pp.55-62,
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| 9 |
Effect of Temperature and Compressive Stress on the Dielectric and Piezoelectric Properties of PIN-PMN-PT Single Crystal
Lim, Jae Gwang;Park, Jae Hwan;Lee, Jeongho;Lee, Sang Goo;
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The Korean Microelectronics and Packaging Society
, v.26, no.4, pp.63-68,
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| 10 |
Effect of Measuring Method on the Evaluation of Piezoelectric and Dielectric Properties of PMN-PT Single Crystal
Kim, Yong Soo;Park, Jae Hwan;Lee, Jeongho;Lee, Sang Goo;
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The Korean Microelectronics and Packaging Society
, v.26, no.4, pp.69-74,
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| 11 |
Reliability Assessment of Flexible InGaP/GaAs Double-Junction Solar Module Using Experimental and Numerical Analysis
Kim, Youngil;Le, Xuan Luc;Choa, Sung-Hoon;
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The Korean Microelectronics and Packaging Society
, v.26, no.4, pp.75-82,
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| 12 |
Preparation and Photoluminescence Properties of LiBaPO4:Eu2+ Phosphors by Solid State Reaction Method
Park, In Yong;
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The Korean Microelectronics and Packaging Society
, v.26, no.4, pp.83-88,
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| 13 |
Fabrication and Adhesion Strength Evaluation of Glass Sealants for Ceramic to Ceramic Component Joining
Heo, Yu Jin;Kim, Hyo Tae;
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The Korean Microelectronics and Packaging Society
, v.26, no.4, pp.89-94,
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| 14 |
Stress Conversion Factor on Penetration Depth of Knoop Indentation for Assessment of Nano Residual Stress
Kim, Won Jun;Kim, Yeong Jin;Kim, Young-Cheon;
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The Korean Microelectronics and Packaging Society
, v.26, no.4, pp.95-100,
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| 15 |
Measurement of EMC/PCB Interfacial Adhesion Energy of Chip Package Considering Warpage
Kim, Hyeong Jun;Ahn, Kwang Ho;Oh, Seung Jin;Kim, Do Han;Kim, Jae Sung;Kim, Eun Sook;Kim, Taek-Soo;
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The Korean Microelectronics and Packaging Society
, v.26, no.4, pp.101-105,
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| 16 |
Carbon Nanotube Passivation layer for Increasing the Solar Water Splitting Performance of CdS/CuInGaSe Photocathode
Bae, Hyojung;Ko, Young-Hee;Park, Jun-Beom;Ko, Hang-Ju;Ryu, Sang-Wan;Ha, Jun-Seok;
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The Korean Microelectronics and Packaging Society
, v.26, no.4, pp.107-111,
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| 17 |
Growth of α-Ga2O3 Epitaxial Films on Al2O3 by Halide Vapor Pressure Epitaxy
Lee, Daejang;Cha, An-Na;Park, Junseong;Noh, Hogyun;Moon, Youngboo;Ha, Jun-Seok;
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The Korean Microelectronics and Packaging Society
, v.26, no.4, pp.113-118,
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| 18 |
Power Generation Properties and Bending Characteristics of a Flexible Thermoelectric Module Fabricated using PDMS Filling Method
Han, Kee Sun;Oh, Tae Sung;
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The Korean Microelectronics and Packaging Society
, v.26, no.4, pp.119-126,
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| 19 |
Surface Modification of Ba0.6Sr0.4TiO3 by Trimethylsilyl Chloride as a Silylation Agent
Lee, Chan;Han, Wooje;Park, Hyung-Ho;
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The Korean Microelectronics and Packaging Society
, v.26, no.4, pp.127-132,
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| 20 |
Thermal Cycle Reliabilties and Cracking Characteristics of Electroplated Cr/Ni-P Coatings
Lee, Jina;Son, Kirak;Lee, Kyu Hwan;Park, Young-Bae;
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The Korean Microelectronics and Packaging Society
, v.26, no.4, pp.133-140,
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| 21 |
Sensitivity Improvement of Shadow Moiré Technique Using LED Light and Deformation Measurement of Electronic Substrate
Yang, Heeju;Joo, Jinwon;
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The Korean Microelectronics and Packaging Society
, v.26, no.4, pp.141-148,
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| 22 |
Stretchable Characteristics and Power Generation Properties of a Stretchable Thermoelectric Module Filled with PDMS
Han, Kee Sun;Oh, Tae Sung;
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The Korean Microelectronics and Packaging Society
, v.26, no.4, pp.149-156,
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| 23 |
Point Defect Engineering Approaches to Enhance the Performance of Thermoelectric Materials
Kim, Hyun-Sik;Jeong, Hyung Mo;Choi, Soon-Mok;Lee, Kyu Hyoung;
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The Korean Microelectronics and Packaging Society
, v.26, no.4, pp.157-161,
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| 24 |
Effect of Sn Decorated MWCNT Particle on Microstructures and Bonding Strengths of the OSP Surface Finished FR-4 Components Assembled with Sn58%Bi Composite Solder Joints
Park, Hyun-Joon;Lee, Choong-Jae;Min, Kyung Deuk;Jung, Seung-Boo;
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The Korean Microelectronics and Packaging Society
, v.26, no.4, pp.163-169,
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