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| 1 |
Wettability Evaluation by Wetting Balance Test and Wetting Characteristics of Solders
Jeon, Wook Sang;Rajendran, Sri Harini;Jung, Jae Pil;
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The Korean Microelectronics and Packaging Society
, v.26, no.3, pp.1-6,
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| 2 |
Laser Micro-Joining and Soldering
Hwang, Seung Jun;Kang, Hye Jun;Kim, Jeng O;Jung, Jae Pil;
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The Korean Microelectronics and Packaging Society
, v.26, no.3, pp.7-13,
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| 3 |
Recent Overview on Power Semiconductor Devices and Package Module Technology
Kim, Kyoung-Ho;Choa, Sung-Hoon;
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The Korean Microelectronics and Packaging Society
, v.26, no.3, pp.15-22,
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| 4 |
Technical Trends of Stretchable Electrodes
Choi, Su Bin;Lee, Cheul-Ro;Jung, Seung-Boo;Kim, Jong-Woong;
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The Korean Microelectronics and Packaging Society
, v.26, no.3, pp.23-36,
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| 5 |
Suppressed Sheet Resistance of Ag Nanostructure Films by O2 Plasma Treatment
Kim, Wonkyung;Roh, Jong Wook;
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The Korean Microelectronics and Packaging Society
, v.26, no.3, pp.37-41,
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| 6 |
Improving Joint Reliability of Lead-free Solder on Flexible Substrate under Cyclic Bending by Adding Graphene Oxide Powder
Ko, Yong-Ho;Yu, Dong-Yurl;Son, Junhyuk;Bang, Junghwan;Kim, Taek-Soo;
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The Korean Microelectronics and Packaging Society
, v.26, no.3, pp.43-49,
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| 7 |
Analysis of Ar Plasma Effects for Copper Nitride Passivation Formation via Design of Experiment
Park, Hae-Sung;Kim, Sarah Eunkyung;
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The Korean Microelectronics and Packaging Society
, v.26, no.3, pp.51-57,
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| 8 |
Solution-Processed Fluorine-Doped Indium Gallium Zinc Oxide Channel Layers for Thin-Film Transistors
Jeong, Sunho;
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The Korean Microelectronics and Packaging Society
, v.26, no.3, pp.59-62,
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| 9 |
Bonding Property and Reliability for Press-fit Interconnection
Oh, Sangjoo;Kim, Dajung;Hong, Won Sik;Oh, Chulmin;
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The Korean Microelectronics and Packaging Society
, v.26, no.3, pp.63-69,
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| 10 |
A Comparison Study on Various Quantum Dots Light Emitting Diodes Using TiO2 Nanoparticles as Inorganic Electron Transport Layer
Kim, Moonbon;Yoon, Changgi;Kim, Jiwan;
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The Korean Microelectronics and Packaging Society
, v.26, no.3, pp.71-74,
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| 11 |
Thickness Effect of SiOx Layer Inserted between Anti-Reflection Coating and p-n Junction on Potential-Induced Degradation (PID) of PERC Solar Cells
Jung, Dongwook;Oh, Kyoung-suk;Jang, Eunjin;Chan, Sung-il;Ryu, Sangwoo;
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The Korean Microelectronics and Packaging Society
, v.26, no.3, pp.75-80,
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| 12 |
Effects of Graphene Oxide Addition on the Electromigration Characteristics of Sn-3.0Ag-0.5Cu Pb-free Solder Joints
Son, Kirak;Kim, Gahui;Ko, Yong-Ho;Park, Young-Bae;
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The Korean Microelectronics and Packaging Society
, v.26, no.3, pp.81-88,
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