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| 1 |
Study on Influencing Factors of Adhesive Strength for Polymer Coating on Metal Adherend by Dolly Test
Baeg, Ju-Hwan;Park, Hyun;Lee, Sung In;Ha, Yungeun;Cho, Young-Rae;
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The Korean Microelectronics and Packaging Society
, v.26, no.2, pp.1-8,
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| 2 |
Double Exposure Laser Interference Lithography for Pattern Diversity using Ultraviolet Continuous-Wave Laser
Ma, Yong-Won;Park, Jun Han;Yun, Dan Hee;Gwak, Cheongyeol;Shin, Bo Sung;
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The Korean Microelectronics and Packaging Society
, v.26, no.2, pp.9-14,
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| 3 |
The Structural, Electrical, and Optical Properties of ZnO Ultra-thin Films Dependent on Film Thickness
Kang, Kyung-Mun;Wang, Yue;Kim, Minjae;Lee, Hong-Sub;Park, Hyung-Ho;
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The Korean Microelectronics and Packaging Society
, v.26, no.2, pp.15-21,
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| 4 |
Chemically Bonded Thermally Expandable Microsphere-silica Composite Aerogel with Thermal Insulation Property for Industrial Use
Lee, Kyu-Yeon;Phadtare, Varsha D.;Choi, Haryeong;Moon, Seung Hwan;Kim, Jong Il;Bae, Young Kwang;Park, Hyung-Ho;
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The Korean Microelectronics and Packaging Society
, v.26, no.2, pp.23-29,
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| 5 |
Development of Polymer Elastic Bump Formation Process and Bump Deformation Behavior Analysis for Flexible Semiconductor Package Assembly
Lee, Jae Hak;Song, Jun-Yeob;Kim, Seung Man;Kim, Yong Jin;Park, Ah-Young;
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The Korean Microelectronics and Packaging Society
, v.26, no.2, pp.31-43,
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| 6 |
Preparation of n-type Bi-Te-Se-based Thermoelectric Materials with Improved Reliability via hot Extrusion Process
Hwang, Jeong Yun;Kim, Yong-Nam;Lee, Kyu Hyoung;
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The Korean Microelectronics and Packaging Society
, v.26, no.2, pp.45-49,
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| 7 |
Electroplating of High Wear Resistant Rhodium using Pulse Current Plating Method
Lee, Seo-Hyang;Lee, Jae-Ho;
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The Korean Microelectronics and Packaging Society
, v.26, no.2, pp.51-54,
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| 8 |
A Study on Optical Characteristic of Plasmonic Nanostructure Depending on Height of Deposited Silver
Kim, J.H.;Jeong, M.Y.;
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The Korean Microelectronics and Packaging Society
, v.26, no.2, pp.55-58,
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| 9 |
Development and Packaging of Multi-channel Imaging Module for Near-infrared Fluorescence Imaging System
Kim, Taehoon;Seo, Kyung Hwan;Lee, Hak Keun;Jeong, Myung Yung;
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The Korean Microelectronics and Packaging Society
, v.26, no.2, pp.59-64,
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| 10 |
오류정정
한국마이크로전자및패키징학회;
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The Korean Microelectronics and Packaging Society
, v.26, no.2, pp.65-66,
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