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http://dx.doi.org/10.6117/kmeps.2019.26.2.0045

Preparation of n-type Bi-Te-Se-based Thermoelectric Materials with Improved Reliability via hot Extrusion Process  

Hwang, Jeong Yun (Department of Materials Science and Engineering, Yonsei University)
Kim, Yong-Nam (Material Technology Center, Korea Testing Laboratory)
Lee, Kyu Hyoung (Department of Materials Science and Engineering, Yonsei University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.26, no.2, 2019 , pp. 45-49 More about this Journal
Abstract
Herein we developed the hot extrusion technology to prepare n-type Bi-Te-Se-based thermoelectric materials with high reliability. Starting ingot was fabricated via melt-solidification process, then pulverized it into powders (${\sim}30{\mu}m$) by using high energy ball milling. By optimization of mold design and temperature-pressure conditions for hot extrusion, dense extrudate of 1.8 mm in diameter with high 00l orientation could be obtained from disc-shape compacted powders (20 mm in diameter). High power factor ${\sim}4.1mW/mK^2$ and enhanced mechanical strength ~50 MPa were simultaneously observed at 300 K.
Keywords
Bi-Te-Se; thermoelectric; hot extrusion; power factor; mechanical strength;
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Times Cited By KSCI : 1  (Citation Analysis)
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