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| 1 |
Aluminum Brazing and Its Principle
Lee, Soon-Jae;Jung, Do-Hyun;Jung, Jae-Pil;
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The Korean Microelectronics and Packaging Society
, v.24, no.4, pp.1-7,
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| 2 |
Recent Trends of MEMS Packaging and Bonding Technology
Choa, Sung-Hoon;Ko, Byoung Ho;Lee, Haeng-Soo;
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The Korean Microelectronics and Packaging Society
, v.24, no.4, pp.9-17,
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| 3 |
Design of Wavelength-free 1×N Optical Splitter using a Tapered Waveguide
Bae, Han Uk;Shim, Young Bo;Park, Jun Tae;Lee, Chang rin;Jeong, Myung Yung;
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The Korean Microelectronics and Packaging Society
, v.24, no.4, pp.19-22,
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| 4 |
Packaging Technology for the Optical Fiber Bragg Grating Multiplexed Sensors
Lee, Sang Mae;
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The Korean Microelectronics and Packaging Society
, v.24, no.4, pp.23-29,
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| 5 |
Fabrication of Vertically Oriented ZnO Micro-crystals array embedded in Polymeric matrix for Flexible Device
Yang, Dong Won;Lee, Won Woo;Park, Won IL;
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The Korean Microelectronics and Packaging Society
, v.24, no.4, pp.31-37,
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| 6 |
Fabrication and Electrical Insulation Property of Thick Film Glass Ceramic Layers on Aluminum Plate for Insulated Metal Substrate
Lee, Seong Hwan;Kim, Hyo Tae;
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The Korean Microelectronics and Packaging Society
, v.24, no.4, pp.39-46,
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| 7 |
Electrical Reliability of ITO Film on Flexible Substrate During bending Deformations and Bending Fatigue
Seol, Jea-Geun;Kim, Byoung-Joon;
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The Korean Microelectronics and Packaging Society
, v.24, no.4, pp.47-52,
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| 8 |
Mechanical and Electrical Failure of ITO Film with Different Shape during Twisting Deformation
Kwon, Y.Y.;Kim, Byoung-Joon;
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The Korean Microelectronics and Packaging Society
, v.24, no.4, pp.53-57,
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| 9 |
Improvement of Photoelectrochemical Properties through Activation Process of p-type GaN
Bang, Seung Wan;Kim, Haseong;Bae, Hyojung;Ju, Jin-Woo;Kang, Sung-Ju;Ha, Jun-Seok;
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The Korean Microelectronics and Packaging Society
, v.24, no.4, pp.59-63,
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| 10 |
Preparation of 40 wt.% Ag-coated Cu Particles with Thick Ag Shells and Suppression of Defects in the Particles
Choi, Eun Byeol;Lee, Jong-Hyun;
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The Korean Microelectronics and Packaging Society
, v.24, no.4, pp.65-71,
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| 11 |
Materials Compatibility and Structure Optimization of Test Department Probe for Quality Test of Fingerprint Sensor
Son, Eun-Won;Youn, Ji Won;Kim, Dae Up;Lim, Jae-Won;Kim, Kwang-Seok;
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The Korean Microelectronics and Packaging Society
, v.24, no.4, pp.73-77,
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| 12 |
Properties of Organic-Inorganic Protective Films on Flexible Plastic Substrates by Spray Coating Method
Lee, Sang Hee;Chang, Ho Jung;
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The Korean Microelectronics and Packaging Society
, v.24, no.4, pp.79-84,
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| 13 |
Improved Photoelectric Conversion Efficiency of Perovskite Solar Cells with TiO2:TiCl4 Electron Transfer Layer
Ahn, Joon-sub;Kang, Seung-gu;Song, Jae-gwan;Kim, Jin-bong;Han, Eun-mi;
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The Korean Microelectronics and Packaging Society
, v.24, no.4, pp.85-90,
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| 14 |
Thermal Performance Analysis for Cu Block and Dense Via-cluster Design of Organic Substrate in Package-On-Package
Lim, HoJeong;Jung, GyuIk;Kim, JiHyun;Fuentes, Ruben;
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The Korean Microelectronics and Packaging Society
, v.24, no.4, pp.91-95,
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