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| 1 |
On-chip Decoupling Capacitor for Power Integrity
Cho, Seungbum;Kim, Sarah Eunkyung;
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The Korean Microelectronics and Packaging Society
, v.24, no.3, pp.1-6,
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| 2 |
A Study on Poly-Si TFT characteristics with string structure for 3D SONOS NAND Flash Memory Cell
Choi, Chae-Hyoung;Choi, Deuk-Sung;Jeong, Seung-Hyun;
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The Korean Microelectronics and Packaging Society
, v.24, no.3, pp.7-11,
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| 3 |
Effect of Acid Catalyst Kinds on the Pore Structural Characteristics of Water Glass based Silica Aerogel
Nah, Ha-Yoon;Jung, Hae-Noo-Ree;Lee, Kyu-Yeon;Ku, Yang Seo;Park, Hyung-Ho;
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The Korean Microelectronics and Packaging Society
, v.24, no.3, pp.13-18,
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| 4 |
Stretchable Deformation-Resistance Characteristics of Metal Thin Films for Stretchable Interconnect Applications II. Characteristics Comparison for Au, Pt, and Cu Thin Films
Park, Donghyun;Oh, Tae Sung;
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The Korean Microelectronics and Packaging Society
, v.24, no.3, pp.19-26,
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| 5 |
Stretchable Deformation-Resistance Characteristics of Metal Thin Films for Stretchable Interconnect Applications I. Effects of a Parylene F Intermediate Layer and PDMS Substrate Swelling
Park, Donghyun;Oh, Tae Sung;
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The Korean Microelectronics and Packaging Society
, v.24, no.3, pp.27-34,
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| 6 |
Possibility of Al-Si Brazing Alloys for Industrial Microjoining Applications
Sharma, Ashutosh;Jung, Jae Pil;
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The Korean Microelectronics and Packaging Society
, v.24, no.3, pp.35-40,
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| 7 |
A Study on Enhanced of Anti-scratch performance of Nanostructured Polymer Surface
Yeo, N.E.;Cho, W.K.;Kim, D.I.;Jeong, M.Y.;
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The Korean Microelectronics and Packaging Society
, v.24, no.3, pp.41-46,
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| 8 |
A Study on Threshold Voltage Degradation by Loss Effect of Trapped Charge in IPD Layer for Program Saturation in a MLC NAND Flash Memory
Choi, Chae-Hyoung;Choi, Deuk-Sung;Jeong, Seung-Hyun;
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The Korean Microelectronics and Packaging Society
, v.24, no.3, pp.47-52,
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| 9 |
A Study on Characteristics of Laser Cladding Layer of STS316L
Hong, SungMoo;Oh, JaeYong;Kim, DongSeob;Chang, SeungCheol;Shin, BoSung;
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The Korean Microelectronics and Packaging Society
, v.24, no.3, pp.53-56,
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| 10 |
Effects of Process Variables on Preparation of Silver-Coated Copper Flakes Using Hydroquinone Reducing Agent
Chee, Sang-Soo;Lee, Jong-Hyun;
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The Korean Microelectronics and Packaging Society
, v.24, no.3, pp.57-62,
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| 11 |
3.7-V Single Battery-Cell High-Efficiency Power Management Circuit and System for UAV-Drones
Kang, Woonsung;Hwang, Sunnam;Chang, Ho Jung;Kim, Hyun-Sik;
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The Korean Microelectronics and Packaging Society
, v.24, no.3, pp.63-69,
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| 12 |
Electrical Behavior of the Circuit Screen-printed on Polyimide Substrate with Infrared Radiation Sintering Energy Source
Kim, Sang-Woo;Gam, Dong-Gun;Jung, Seung-Boo;
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The Korean Microelectronics and Packaging Society
, v.24, no.3, pp.71-76,
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| 13 |
Effect of Electroplating Parameters on Conductivity and Hardness of Ni-P Alloy
Kim, Nam-Gil;Sun, Yong-Bin;
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The Korean Microelectronics and Packaging Society
, v.24, no.3, pp.77-81,
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