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| 1 |
Wettability Analysis of Solders using Wetting Balance Test
Jung, Do-hyun;Lim, Dong-uk;Baek, Bum-gyu;Yim, Song-hee;Yoon, Jong-hyuk;Jung, Jae Pil;
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The Korean Microelectronics and Packaging Society
, v.24, no.2, pp.1-9,
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| 2 |
Effect of Fine Alumina Filler Addition on the Thermal Conductivity of Non-conductive Paste (NCP) for Multi Flip Chip Bonding
Jung, Da-Hoon;Lim, Da-Eun;Lee, So-Jeong;Ko, Yong-Ho;Kim, Jun-Ki;
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The Korean Microelectronics and Packaging Society
, v.24, no.2, pp.11-15,
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| 3 |
Simulation of Horizontal Thin-film Thermoelectric Cooler for the Mobile Electronics Thermal Management
Park, Sangkug;Park, Hong-Bum;Joo, Young-Chang;Joo, Youngcheol;
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The Korean Microelectronics and Packaging Society
, v.24, no.2, pp.17-21,
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| 4 |
Reliability Assessment and Prediction of Solder Joints in High Temperature Heaters
Park, Eunju;Kwon, Daeil;Sa, Yoonki;
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The Korean Microelectronics and Packaging Society
, v.24, no.2, pp.23-27,
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| 5 |
Manufacturing of Metal Micro-wire Interconnection on Submillimeter Diameter Catheter
Jo, Woosung;Seo, Jeongmin;Kim, Taek-Soo;
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The Korean Microelectronics and Packaging Society
, v.24, no.2, pp.29-35,
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| 6 |
Influence of Process Conditions on Properties of Cu2O Thin Films Grown by Electrodeposition
Cho, Jae Yu;Ha, Jun Seok;Ryu, Sang-Wan;Heo, Jaeyeong;
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The Korean Microelectronics and Packaging Society
, v.24, no.2, pp.37-41,
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| 7 |
Study of the effect of vacuum annealing on sputtered SnxOy thin films by SnO/Sn composite target
Kim, Cheol;Cho, Seungbum;Kim, Sungdong;Kim, Sarah Eunkyung;
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The Korean Microelectronics and Packaging Society
, v.24, no.2, pp.43-48,
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| 8 |
Study on the Change of Electrical Properties of two-dimensional SnSe2 Material via Cl doping under a High Temperature Condition
Moon, Seung Pil;Kim, Sung Wng;Sohn, Hiesang;Kim, Tae Wan;Lee, Kyu Hyoung;Lee, Kimoon;
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The Korean Microelectronics and Packaging Society
, v.24, no.2, pp.49-53,
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| 9 |
3-Dimensional Shape Inspection for Micro BGA by LED Reflection Image
Kim, Jee Hong;
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The Korean Microelectronics and Packaging Society
, v.24, no.2, pp.55-59,
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| 10 |
Effect of Coolants and Metal Bumps on the heat Removal of Liquid Cooled Microchannel System
Won, Yonghyun;Kim, Sungdong;Kim, Sarah Eunkyung;
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The Korean Microelectronics and Packaging Society
, v.24, no.2, pp.61-67,
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| 11 |
Effect of Post-Annealing Condition on the Peel Strength of Screen-printed Ag Film and Polyimide Substrate
Bae, Byung-Hyun;Lee, Hyeonchul;Son, Kirak;Park, Young-Bae;
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The Korean Microelectronics and Packaging Society
, v.24, no.2, pp.69-74,
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