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| 1 |
Soft Magnetic Property of Ternary Fe-9.8Si-6.0Al Alloy Using by Recycling Fe-Si Electrical Steel Sheet Scrap
Hong, Won Sik;Yang, Hyoung Woo;Park, Ji-Yeon;Oh, Chulmin;Lee, Woo Sung;Kim, Seung Gyeom;Han, Sang Jo;Shim, Geum Taek;Kim, Hwi-Jun;
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The Korean Microelectronics and Packaging Society
, v.24, no.1, pp.1-8,
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| 2 |
Recent Advances in Thermoelectric Power Generation Technology
Sharma, Ashutosh;Lee, Jun Hyeong;Kim, Kyung Heum;Jung, Jae Pil;
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The Korean Microelectronics and Packaging Society
, v.24, no.1, pp.9-16,
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| 3 |
Transient Liquid Phase (TLP) Bonding of Device for High Temperature Operation
Jung, Do-hyun;Roh, Myung-hwan;Lee, Jun-hyeong;Kim, Kyung-heum;Jung, Jae Pil;
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The Korean Microelectronics and Packaging Society
, v.24, no.1, pp.17-25,
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| 4 |
Trasient Liquid Phase bonding for Power Semiconductor
Roh, Myong-Hoon;Nishikawa, Hiroshi;Jung, Jae Pil;Kim, Wonjoong;
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The Korean Microelectronics and Packaging Society
, v.24, no.1, pp.27-34,
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| 5 |
Thermo-Mechanical Reliability of TSV based 3D-IC
Yoon, Taeshik;Kim, Taek-Soo;
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The Korean Microelectronics and Packaging Society
, v.24, no.1, pp.35-43,
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| 6 |
Effect of Zn content on Shear Strength of Sn-0.7Cu-xZn and OSP surface finished Joint with High Speed Shear Test
Choi, Ji-Na;Bang, Jae-Oh;Jung, Seung-Boo;
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The Korean Microelectronics and Packaging Society
, v.24, no.1, pp.45-50,
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| 7 |
Fabrication of Single Capacitive type Differential pressure sensor for Differential Flow meter
Shin, Kyu-Sik;Song, Sangwoo;Lee, Kyungil;Lee, Daesung;Jung, Jae Pil;
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The Korean Microelectronics and Packaging Society
, v.24, no.1, pp.51-56,
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| 8 |
Deformation Measurement of Electronic Components in Mobile Device Using High Sensitivity Shadow Moiré Technique
Yang, Hee-Gul;Joo, Jin-Won;
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The Korean Microelectronics and Packaging Society
, v.24, no.1, pp.57-65,
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| 9 |
Kinetic Analyses on Thermal Degradation of Epoxy Based Adhesive for Packaging Application
Kim, Yeong K.;Lee, Yoon-Sun;
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The Korean Microelectronics and Packaging Society
, v.24, no.1, pp.67-73,
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| 10 |
Interfacial Adhesion and Reliability between Epoxy Resin and Polyimide for Flexible Printed Circuit Board
Kim, Jeong-Kyu;Son, Kirak;Park, Young-Bae;
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The Korean Microelectronics and Packaging Society
, v.24, no.1, pp.75-81,
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| 11 |
Solderability of thin ENEPIG plating Layer for Fine Pitch Package application
Back, Jong-Hoon;Lee, Byung-Suk;Yoo, Sehoon;Han, Deok-Gon;Jung, Seung-Boo;Yoon, Jeong-Won;
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The Korean Microelectronics and Packaging Society
, v.24, no.1, pp.83-90,
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| 12 |
Study of high Speed Laser Cutting of LED Module
Choi, Won Yong;Choa, Sung-Hoon;
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The Korean Microelectronics and Packaging Society
, v.24, no.1, pp.91-101,
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| 13 |
Numerical Fatigue Life Prediction of IGBT Module for Electronic Locomotive
Kwon, Oh Young;Jang, Young Moon;Lee, Young-ho;Choa, Sung-Hoon;
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The Korean Microelectronics and Packaging Society
, v.24, no.1, pp.103-111,
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