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| 1 |
Trends of Researches and Technologies of Electronic Packaging Using Graphene
Ko, Yong-Ho;Choi, Kyeonggon;Kim, Sang Woo;Yu, Dong-Yurl;Bang, Junghwan;Kim, Taek-Soo;
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The Korean Microelectronics and Packaging Society
, v.23, no.2, pp.1-10,
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| 2 |
Manufacturing Technology for Tape Casting and Soft Magnetic Powder Using by Recycling Scrap of Fe-Si Electrical Sheet
Hong, Won Sik;Kim, Sang Hyun;Park, Ji-Yeon;Oh, Chulmin;Lee, Woo Sung;Kim, Seung Gyeom;Han, Sang Jo;Shim, Geum Taek;Kim, Hwi-Jun;
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The Korean Microelectronics and Packaging Society
, v.23, no.2, pp.11-18,
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| 3 |
Measurement Technologies of Mechanical Properties of Polymers used for Flexible and Stretchable Electronic Packaging
Kim, Cheolgyu;Lee, Tae-Ik;Kim, Taek-Soo;
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The Korean Microelectronics and Packaging Society
, v.23, no.2, pp.19-28,
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| 4 |
Overview on Smart Sensor Technology for Biometrics in IoT Era
Kim, Kwang-Seok;Kim, Dae Up;
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The Korean Microelectronics and Packaging Society
, v.23, no.2, pp.29-35,
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| 5 |
Reliability Assessment of Low-Power Processor Packages for Supercomputers
Park, Ju-Young;Kwon, Daeil;Nam, Dukyun;
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The Korean Microelectronics and Packaging Society
, v.23, no.2, pp.37-42,
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| 6 |
Study on the Properties of TiO2 Film Deposited by ALD at Low Temperature
Park, Won Hee;Shin, Jeong Woo;Yang, Byung Chan;Park, Man-Jin;Jang, Dong Young;An, Jihwan;
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The Korean Microelectronics and Packaging Society
, v.23, no.2, pp.43-47,
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| 7 |
Effects of Post-annealing and Temperature/Humidity Conditions on the Interfacial Adhesion Energies of ALD RuAlO Diffusion Barrier Layer for Cu Interconnects
Lee, Hyeonchul;Jeong, Minsu;Bae, Byung-Hyun;Cheon, Taehun;Kim, Soo-Hyun;Park, Young-Bae;
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The Korean Microelectronics and Packaging Society
, v.23, no.2, pp.49-55,
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| 8 |
Electrospun Magnetic Nanofiber as Multifunctional Flexible EMI-Shielding Layer and its Optimization on the Effectiveness
Yu, Jiwoo;Nam, Dae-Hyun;Lee, Young-Joo;Joo, Young-Chang;
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The Korean Microelectronics and Packaging Society
, v.23, no.2, pp.57-63,
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| 9 |
Development of Energy Harvesting Hybrid system consisted of Electrochromic Device and Dye-Sensitized Solar Cell using Nano Particle Deposition System
Kim, Kwangmin;Kim, Hyungsub;Choi, Dahyun;Lee, Minji;Park, Yunchan;Chu, Wonshik;Chun, Dooman;Lee, Caroline Sunyong;
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The Korean Microelectronics and Packaging Society
, v.23, no.2, pp.65-71,
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| 10 |
IC Thermal Management Using Microchannel Liquid Cooling Structure with Various Metal Bumps
Won, Yonghyun;Kim, Sungdong;Kim, Sarah Eunkyung;
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The Korean Microelectronics and Packaging Society
, v.23, no.2, pp.73-78,
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| 11 |
Control of Position of Neutral Line in Flexible Microelectronic System Under Bending Stress
Seo, Seung-Ho;Lee, Jae-Hak;Song, Jun-Yeob;Lee, Won-Jun;
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The Korean Microelectronics and Packaging Society
, v.23, no.2, pp.79-84,
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| 12 |
A Study on Fluorescence Imaging System Characteristics depending on Tilting of Band Pass Filter
Kim, Taehoon;Cho, Sang Uk;Park, Chan Sik;Lee, Hak-Guen;Kim, Doo-In;Jeong, Myung Yung;
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The Korean Microelectronics and Packaging Society
, v.23, no.2, pp.85-89,
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| 13 |
Effects of Demolding Temperature on Formability and Optical Properties of Anti-reflective Nanostructure
Yeo, N.E.;Shim, Y.B.;Cho, S.U.;Kim, D.I.;Kim, K.N.;Jang, K.S.;Jeong, M.Y.;
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The Korean Microelectronics and Packaging Society
, v.23, no.2, pp.91-96,
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| 14 |
Effects of Different Pretreatment Methods and Amounts of Reductant on Preparation of Silver-coated Copper Flakes Using Electroless Plating
Oh, Sang Joo;Kim, Ji Hwan;Lee, Jong-Hyun;
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The Korean Microelectronics and Packaging Society
, v.23, no.2, pp.97-104,
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