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| 1 |
Aluminium Based Brazing Fillers for High Temperature Electronic Packaging Applications
Sharma, Ashutosh;Jung, Jae-Pil;
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The Korean Microelectronics and Packaging Society
, v.22, no.4, pp.1-5,
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| 2 |
Cu Electroplating and Low Alpha Solder Bumping on TSV for 3-D Packaging
Jung, Do hyun;Kumar, Santosh;Jung, Jae pil;
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The Korean Microelectronics and Packaging Society
, v.22, no.4, pp.7-14,
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| 3 |
A Review of Ag Paste Bonding for Automotive Power Device Packaging
Roh, Myong-Hoon;Nishikawa, Hiroshi;Jung, Jae-Pil;
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The Korean Microelectronics and Packaging Society
, v.22, no.4, pp.15-23,
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| 4 |
PLC Devices Fabricated on Flexible Plastic Substrate by Roll-to-Roll Imprint Lithography
Kang, Ho Ju;Kim, Taehoon;Jeong, Myung Yung;
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The Korean Microelectronics and Packaging Society
, v.22, no.4, pp.25-29,
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| 5 |
Study of On-chip Liquid Cooling in Relation to Micro-channel Design
Won, Yonghyun;Kim, Sungdong;Kim, Sarah Eunkyung;
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The Korean Microelectronics and Packaging Society
, v.22, no.4, pp.31-36,
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| 6 |
A Study on Heat Transfer Characteristics of PCBs with a Carbon CCL
Cho, Seunghyun;Jang, Junyoung;Kim, Jeong-Cheol;Kang, Suk Won;Seong, Il;Bae, Kyung Yun;
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The Korean Microelectronics and Packaging Society
, v.22, no.4, pp.37-46,
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| 7 |
A Study on Thermal Behavior and Reliability Characteristics of PCBs with a Carbon CCL
Cho, Seunghyun;Kim, Jeong-Cheol;Kang, Suk Won;Seong, Il;Bae, Kyung Yun;
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The Korean Microelectronics and Packaging Society
, v.22, no.4, pp.47-56,
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| 8 |
A Method for Application of Ammonium-based Pretreatment Solution in Preparation of Copper Flakes Coated by Electroless Ag Plating
Kim, Ji Hwan;Lee, Jong-Hyun;
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The Korean Microelectronics and Packaging Society
, v.22, no.4, pp.57-63,
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| 9 |
Evaluation of Thermal Conductivity for Screen-Printed AlN Layer on Al Substrate in Thickness Direction
Kim, Jong-Gu;Park, Hong-Seok;Kim, Hyun;Hahn, Byung-Dong;Cho, Young-Rae;
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The Korean Microelectronics and Packaging Society
, v.22, no.4, pp.65-70,
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| 10 |
Study on the Electrode Design for an Advanced Structure of Vertical LED
Park, Jun-Beom;Park, Hyung-Jo;Jeong, Tak;Kang, Sung-Ju;Ha, Jun-Seok;Leem, See-Jong;
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The Korean Microelectronics and Packaging Society
, v.22, no.4, pp.71-76,
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| 11 |
Ce0.8Sm0.2O2 Sol-gel Modification on La0.8Sr0.2Mn0.8Cu0.2O3 Cathode for Intermediate Temperature Solid Oxide Fuel Cell
Lee, Seung Jin;Kang, Choon-Hyoung;Chung, Chang-Bock;Yun, Jeong Woo;
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The Korean Microelectronics and Packaging Society
, v.22, no.4, pp.77-82,
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| 12 |
Hybrid Fabrication of Screen-printed Pb(Zr,Ti)O3 Thick Films Using a Sol-infiltration and Photosensitive Direct-patterning Technique
Lee, J.-H.;Kim, T.S.;Park, H.-H.;
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The Korean Microelectronics and Packaging Society
, v.22, no.4, pp.83-89,
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| 13 |
Elastic Modulus of Locally Stiffness-variant Polydimethylsiloxane Substrates for Stretchable Electronic Packaging Applications
Oh, Hyun-Ah;Park, Donghyeun;Han, Kee-Sun;Oh, Tae Sung;
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The Korean Microelectronics and Packaging Society
, v.22, no.4, pp.91-98,
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| 14 |
Study on the Relationship between Concentration of JGB and Current Density in TSV Copper filling
Jang, Se-Hyun;Choi, Kwang-Seong;Lee, Jae-Ho;
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The Korean Microelectronics and Packaging Society
, v.22, no.4, pp.99-104,
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| 15 |
Analyses on Airbag Sensor Signals by Different Packaging
Kim, Yeong K.;Kang, Hyun Jin;Kim, Joon Ki;
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The Korean Microelectronics and Packaging Society
, v.22, no.4, pp.105-109,
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| 16 |
Study on the Passivation of Si Surface by Incorporation of Nitrogen in Al2O3 Thin Films Grown by Atomic Layer Deposition
Hong, Hee Kyeung;Heo, Jaeyeong;
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The Korean Microelectronics and Packaging Society
, v.22, no.4, pp.111-115,
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| 17 |
Deformation Behavior of Locally Stiffness-variant Stretchable Substrates Consisting of the Island Structure
Oh, Hyun-Ah;Park, Donghyeun;Shin, Soo Jin;Oh, Tae Sung;
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The Korean Microelectronics and Packaging Society
, v.22, no.4, pp.117-123,
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