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| 1 |
Lead-free Solder Technology and Reliability for Automotive Electronics
Lee, Soon-Jae;Jung, Jae-Pil;
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The Korean Microelectronics and Packaging Society
, v.22, no.3, pp.1-7,
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| 2 |
Past and Present Research Topics within the Korean Micoelectronics and Packaging Using Social Network Analysis
Lee, Hyunjoung;Sohn, Il;
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The Korean Microelectronics and Packaging Society
, v.22, no.3, pp.9-17,
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| 3 |
Effects of Sputtering Conditions of TiW Under Bump Metallurgy on Adhesion Strength of Au Bump Formed on Al and SiN Films
Jo, Yang-Geun;Lee, Sang-Hee;Kim, Ji-Mook;Kim, Hyun-Sik;Chang, Ho-Jung;
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The Korean Microelectronics and Packaging Society
, v.22, no.3, pp.19-23,
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| 4 |
Wettability of SAC305-coated Cu Fabricated by Low Temperature Process Using Ultrafine SAC305 Nanoparticles
Shin, Yong Moo;Choi, Tae Jong;Cho, Kyung Jin;Jang, Seok Pil;Lee, Jong-Hyun;
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The Korean Microelectronics and Packaging Society
, v.22, no.3, pp.25-30,
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| 5 |
High Speed Direct Bonding of Silicon Wafer Using Atmospheric Pressure Plasma
Cha, Yong-Won;Park, Sang-Su;Shin, Ho-Jun;Kim, Yong Taek;Lee, Jung Hoon;Suh, Il Woong;Choa, Sung-Hoon;
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The Korean Microelectronics and Packaging Society
, v.22, no.3, pp.31-38,
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| 6 |
Effect of CNT-Ag Composite Pad on the Contact Resistance of Flip-Chip Joints Processed with Cu/Au Bumps
Choi, Jung-Yeol;Oh, Tae Sung;
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The Korean Microelectronics and Packaging Society
, v.22, no.3, pp.39-44,
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| 7 |
Magnetic Properties of Hard/Soft Nanocomposite Ferrite Synthesized by Self-Combustion Precursors
Oh, Young Woo;Ahn, Jong Gyeon;
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The Korean Microelectronics and Packaging Society
, v.22, no.3, pp.45-50,
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| 8 |
A Study of Joint Reliability According to Various Cu Contents between Electrolytic Ni and Electroless Ni Pad Finish
Lee, Hyun Kyu;Chun, Myung Ho;Chu, Yong Chul;Oh, Kum-Sool;
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The Korean Microelectronics and Packaging Society
, v.22, no.3, pp.51-56,
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| 9 |
Sensitivity Enhancement of Shadow Moiré Technique for Warpage Measurement of Electronic Packages
Lee, Dong-Sun;Joo, Jin-Won;
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The Korean Microelectronics and Packaging Society
, v.22, no.3, pp.57-65,
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| 10 |
Effect of Interface on Thermal Conductivity of Clad Metal through Thickness Direction for Heat Sink
Kim, Jong-Gu;Kim, Dong-Yong;Kim, Hyun;Hahn, Byung-Dong;Cho, Young-Rae;
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The Korean Microelectronics and Packaging Society
, v.22, no.3, pp.67-72,
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| 11 |
Fabrication of Monolithic Spectrometer Module Based on Planar Optical Waveguide Platform using UV Imprint Lithography
Oh, Seung hun;Jeong, Myung yung;Kim, Hwan gi;Choi, Hyun young;
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The Korean Microelectronics and Packaging Society
, v.22, no.3, pp.73-77,
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