|
| 1 |
Optimal Interval Censoring Design for Reliability Prediction of Electronic Packages
Kwon, Daeil;Shin, Insun;
/
The Korean Microelectronics and Packaging Society
, v.22, no.2, pp.1-4,
|
|
| 2 |
Thermal Management on 3D Stacked IC
Kim, Sungdong;
/
The Korean Microelectronics and Packaging Society
, v.22, no.2, pp.5-9,
|
|
| 3 |
3-D Hetero-Integration Technologies for Multifunctional Convergence Systems
Lee, Kang-Wook;
/
The Korean Microelectronics and Packaging Society
, v.22, no.2, pp.11-19,
|
|
| 4 |
Study on the Enhanced Specific Surface Area of Mesoporous Titania by Annealing Time Control: Gas Sensing Property
Hong, M.-H.;Park, Ch.-S.;Park, H.-H.;
/
The Korean Microelectronics and Packaging Society
, v.22, no.2, pp.21-26,
|
|
| 5 |
Study of Chip-level Liquid Cooling for High-heat-flux Devices
Park, Manseok;Kim, Sungdong;Kim, Sarah Eunkyung;
/
The Korean Microelectronics and Packaging Society
, v.22, no.2, pp.27-31,
|
|
| 6 |
A Study on the Agglomeration of BaTiO3 Nanoparticles with Differential Synthesis Route
Han, W.-J.;Yoo, B.-Y.;Park, H.-H.;
/
The Korean Microelectronics and Packaging Society
, v.22, no.2, pp.33-39,
|
|
| 7 |
Introduction of Routable Molded Lead Frame and its Application
Kim, ByongJin;Bang, Wonbae;Kim, GiJung;Jung, JiYoung;Yoon, JuHoon;
/
The Korean Microelectronics and Packaging Society
, v.22, no.2, pp.41-45,
|
|
| 8 |
Effects of PCB Surface Finishes on in-situ Intermetallics Growth and Electromigration Characteristics of Sn-3.0Ag-0.5Cu Pb-free Solder Joints
Kim, Sung-Hyuk;Park, Gyu-Tae;Lee, Byeong-Rok;Kim, Jae-Myeong;Yoo, Sehoon;Park, Young-Bae;
/
The Korean Microelectronics and Packaging Society
, v.22, no.2, pp.47-53,
|
|
| 9 |
Novel Low-Volume Solder-on-Pad Process for Fine Pitch Cu Pillar Bump Interconnection
Bae, Hyun-Cheol;Lee, Haksun;Eom, Yong-Sung;Choi, Kwang-Seong;
/
The Korean Microelectronics and Packaging Society
, v.22, no.2, pp.55-59,
|
|
| 10 |
Warpage Analysis for Top and Bottom Packages of Package-on-Package Processed with Thin Substrates
Park, D.H.;Shin, S.J.;Ahn, S.G.;Oh, T.S.;
/
The Korean Microelectronics and Packaging Society
, v.22, no.2, pp.61-68,
|
|