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| 1 |
Power Module Packaging Technology with Extended Reliability for Electric Vehicle Applications
Yoon, Jeong-Won;Bang, Jung-Hwan;Ko, Yong-Ho;Yoo, Se-Hoon;Kim, Jun-Ki;Lee, Chang-Woo;
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The Korean Microelectronics and Packaging Society
, v.21, no.4, pp.1-13,
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| 2 |
Alternative Sintering Technology of Printed Nanoparticles for Roll-to-Roll Process
Lee, Eun Kyung;Eun, Kyoungtae;Ahn, Young Seok;Kim, Yong Taek;Chon, Min-Woo;Choa, Sung-Hoon;
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The Korean Microelectronics and Packaging Society
, v.21, no.4, pp.15-24,
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| 3 |
NIR Fluorescence Imaging Systems with Optical Packaging Technology
Yang, Andrew Wootae;Cho, Sang Uk;Jeong, Myung Yung;Choi, Hak Soo;
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The Korean Microelectronics and Packaging Society
, v.21, no.4, pp.25-31,
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| 4 |
Four Point Bending Test for Adhesion Testing of Packaging Strictures: A Review
Mahan, Kenny;Han, Bongtae;
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The Korean Microelectronics and Packaging Society
, v.21, no.4, pp.33-39,
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| 5 |
The activation Energy of the Niobium donor in n-type TiO2 film grown by Pulsed Laser Deposition
Bae, Hyojung;Ha, Jun-Seok;Park, Seung Hwan;
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The Korean Microelectronics and Packaging Society
, v.21, no.4, pp.41-44,
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| 6 |
Growth of Non-Polar a-plane ZnO Layer On R-plane (1-102) Sapphire Substrate by Hydrothermal Synthesis
Jang, Jooil;Oh, Tae-Seong;Ha, Jun-Seok;
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The Korean Microelectronics and Packaging Society
, v.21, no.4, pp.45-49,
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| 7 |
Electrical Resistivity and Thermal Conductivity of Paste Containing Ag-coated Cu Flake Filler
Kim, Gahae;Jung, Kwang-Mo;Moon, Jong-Tae;Lee, Jong-Hyun;
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The Korean Microelectronics and Packaging Society
, v.21, no.4, pp.51-56,
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| 8 |
The Improvement of Electrical Characteristics of Inkjet-printed Cu films with Stress Relaxation during Thermal Treatment
Yi, Seol-Min;Joo, Young-Chang;
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The Korean Microelectronics and Packaging Society
, v.21, no.4, pp.57-62,
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| 9 |
An investigation on dicing 28-nm node Cu/low-k wafer with a Picosecond Pulse Laser
Hsu, Hsiang-Chen;Chu, Li-Ming;Liu, Baojun;Fu, Chih-Chiang;
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The Korean Microelectronics and Packaging Society
, v.21, no.4, pp.63-68,
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| 10 |
Flexible Durability of Ultra-Thin FPCB
Jung, Hoon-Sun;Eun, Kyoungtae;Lee, Eun-Kyung;Jung, Ki-Young;Choi, Sung-Hoon;Choa, Sung-Hoon;
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The Korean Microelectronics and Packaging Society
, v.21, no.4, pp.69-76,
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| 11 |
The Effect of Graphene on the Electrical Properties of a Stretchable Carbon Electrode
Lee, T.W.;Park, H.H.;
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The Korean Microelectronics and Packaging Society
, v.21, no.4, pp.77-82,
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| 12 |
Printing Morphology and Rheological Characteristics of Lead-Free Sn-3Ag-0.5Cu (SAC) Solder Pastes
Sharma, Ashutosh;Mallik, Sabuj;Ekere, Nduka N.;Jung, Jae-Pil;
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The Korean Microelectronics and Packaging Society
, v.21, no.4, pp.83-89,
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| 13 |
Cu-Filling Behavior in TSV with Positions in Wafer Level
Lee, Soon-Jae;Jang, Young-Joo;Lee, Jun-Hyeong;Jung, Jae-Pil;
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The Korean Microelectronics and Packaging Society
, v.21, no.4, pp.91-96,
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| 14 |
Effect of Aging treatment and Epoxy on Bonding Strength of Sn-58Bi solder and OSP-finished PCB
Kim, Jungsoo;Myung, Woo-Ram;Jung, Seung-Boo;
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The Korean Microelectronics and Packaging Society
, v.21, no.4, pp.97-103,
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| 15 |
Effects of Organic Passivation Films on Properties of Polymer Solar Cells with P3HT:PC61BM Active Layers
Lee, Sang Hee;Park, Byung Min;Cho, Yang Keun;Chang, Ho Jung;Jung, Jae Jin;Pyee, Jaeho;
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The Korean Microelectronics and Packaging Society
, v.21, no.4, pp.105-110,
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| 16 |
Effect of Dynamic Electric Fields on Dielectric Reliability in Cu Damascene Interconnects
Yeon, Han-Wool;Song, Jun-Young;Lim, Seung-Min;Bae, Jang-Yong;Hwang, Yuchul;Joo, Young-Chang;
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The Korean Microelectronics and Packaging Society
, v.21, no.4, pp.111-115,
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| 17 |
Cu Through-Via Formation using Open Via-hole Filling with Electrodeposition
Kim, Jae-Hwan;Park, Dae-Woong;Kim, Min-Young;Oh, Tae Sung;
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The Korean Microelectronics and Packaging Society
, v.21, no.4, pp.117-123,
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| 18 |
Variation of Elastic Stiffness of Polydimethylsiloxane (PDMS) Stretchable Substrates for Wearable Packaging Applications
Choi, Jung-Yeol;Park, Dae-Woong;Oh, Tae Sung;
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The Korean Microelectronics and Packaging Society
, v.21, no.4, pp.125-131,
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| 19 |
Fabrication of Cu Flakes by Ball Milling of Sub-micrometer Spherical Cu Particles
Kim, Ji Hwan;Lee, Jong-Hyun;
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The Korean Microelectronics and Packaging Society
, v.21, no.4, pp.133-137,
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