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http://dx.doi.org/10.6117/kmeps.2014.21.4.133

Fabrication of Cu Flakes by Ball Milling of Sub-micrometer Spherical Cu Particles  

Kim, Ji Hwan (Department of Materials Science & Engineering, Seoul National University of Science & Technology)
Lee, Jong-Hyun (Department of Materials Science & Engineering, Seoul National University of Science & Technology)
Publication Information
Journal of the Microelectronics and Packaging Society / v.21, no.4, 2014 , pp. 133-137 More about this Journal
Abstract
As a preceding process for preparing several micrometer sized Ag-coated Cu flakes, ball milling of submicrometer-sized Cu particles synthesized through a wet chemical method was performed in order to convert the particles into flakes. To suppress oxidation and aggregation of the particles during ball milling, ethylene glycol and ethyl acetate were used as a medium and a surface modifying agent, respectively. Results obtained with different rotation speeds of a jar indicated that the rotation speed changes a rotating mode, and strikingly alters the final shapes and shape uniformity of Cu particles after milling. The diameter of zirconia ball was also confirmed. Although there was aggregates in the initial submicrometer-sized Cu particles, therefore, well-dispersed Cu flakes with a size of several micrometers were successfully prepared by ball milling through optimization of rotation speed, amount of ethyl acetate, and diameter of zirconia ball.
Keywords
Submicrometer-sized Cu particle; Ball milling; Cu flake; Surface modifying agent; Rotation speed;
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Times Cited By KSCI : 2  (Citation Analysis)
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