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http://dx.doi.org/10.6117/kmeps.2014.21.2.091

High-Speed Shear Test Characterization of Sn-Ag-Cu-In Quaternary Solder Joint  

Kim, Ju-Hyung (Department of Materials Science & Engineering, Seoul National University of Science and Technology)
Hyun, Chang-Yong (Department of Materials Science & Engineering, Seoul National University of Science and Technology)
Publication Information
Journal of the Microelectronics and Packaging Society / v.21, no.2, 2014 , pp. 91-97 More about this Journal
Abstract
With Pb-free solder joints containing Sn-Ag-Cu-based ternary alloys (Sn-1.0 wt.%Ag-0.5Cu and Sn-4.0Ag-0.5Cu) and Sn-Ag-Cu-In-based quaternary alloys (Sn-1.0Ag-0.5Cu-1.0In, Sn-1.2Ag-0.5Cu-0.4In, Sn-1.2Ag-0.5Cu-0.6In, and Sn-1.2Ag-0.7Cu-0.4In), fracture-mode change, shear strengths, and fracture energies were observed and measured under a high-speed shear test of 500 mm/s. The samples in each composition were prepared with as-reflowed ones or solid-aged ones at $125^{\circ}C$ to 500 h. As a result, it was observed that ductile or quasi-ductile fracture modes occurs in the most of Sn-Ag-Cu-In samples. The happening frequency of a quasi-ductile fracture mode showed that the Sn-Ag-Cu-In joints possessed ductile fracture properties more than that of Sn-3.0Ag-0.5Cu in the high-speed shear condition. Moreover, the Sn-Ag-Cu-In joints presented averagely fracture energies similar to those of Sn-Ag-Cu joints. While maximum values in the fracture energies were measured after the solid aging for 100 h, clear decreases in the fracture energies were observed after the solid aging for 500 h. This result indicated that reliability degradation of the Sn-Ag-Cu-In solder joints might accelerate from about that time.
Keywords
Sn-Ag-Cu-In; Pb-free solder; high-speed shear test; fracture mode; fracture energy;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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