1 |
J. -W. Kim and S. -B. Jung, "Experimental and Finite Element Analysis of the Shear Speed Effects on the Sn-Ag and Sn-Ag- Cu BGA Solder Joints", Mater. Sci. Eng. A, 371(1-2), 267 (2004).
DOI
ScienceOn
|
2 |
J. -H. Choi and T. -S. Oh, "Comparison of Shear Strength and Shear Energy for 48Sn-52In Solder Bumps with Variation of Reflow Conditions", J. Microelectron. Packag. Soc., 12(4), 351 (2005).
|
3 |
F. Song, S. W. R. Lee, K. Newman, B. Sykes and S. Clark, "High-Speed Solder Ball Shear and Pull Test vs. Board Level Mechanical Drop Tests: Correlation of Failure Mode and Loading Speed", Proc. 57th ECTC, Reno, 1504, IEEE CPMT (2007).
|
4 |
J. -K. Jang, S. -S. Ha, S. -O. Ha, J. -G. Lee, J. -T. Moon, J. -H. Park, W. -C. Seo and S. -B. Jung, "Mechanical Reliability of Sn-37Pb BGA Solder Joints with High-Speed Shear Test", J. Microelectron. Packag. Soc., 15(4), 65 (2008).
|
5 |
I. -N. Jang, J. -H. Park and Y. -S. Ahn, "Effect of Reflow Number and Surface Finish on the High Speed Shear Properties of Sn-Ag-Cu Lead-Free Solder Bump", J. Microelectron. Packag. Soc., 16(3), 11 (2009).
|
6 |
J. -H. Ahn, K. -S. Kim, Y. -C. Lee, Y. Kim and S. -B. Jung, "Regulation in Shear Test Method for BGA of Flip-chip Packages", J. Microelectron. Packag. Soc., 17(3), 1 (2010).
|
7 |
D. -H. Jung, Y. -G. Lee and J. -P. Jung, "Shearing Characteristics of Sn3.0AgO.5Cu Solder Ball for Standardization of High Speed Shear Test", J. Microelectron. Packag. Soc., 18(1), 35 (2011).
|
8 |
A -M. Yu, M. -S. Kim, C. -W. Lee and J. -H. Lee, "Wetting and Interfacial Reaction Characteristics of Sn-1.2Ag-0.5CuxIn Quaternary Solder Alloys", Met, Mater. Int., 17(3), 521 (2011).
DOI
ScienceOn
|
9 |
A -M. Yu, C. -W. Lee, M. -S. Kim and J. -H. Lee, "The Effect of the Addition of In on the Reaction and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder Alloy", Met. Mater. Int., 13(6), 517 (2007).
DOI
ScienceOn
|
10 |
A -M. Yu, C. -W. Lee, J. -H. Kim, M. -S. Kim and J. -H. Lee, "Effect of In Addition on the Reaction and Mechanical Properties in Sn-Ag-Cu-In Solder Alloy", Proc. 9th International Conference on Electronic Materials and Packaging (EMAP), Daejeon, 1, IEEE Components, Packaging and Manufacturing Technology Society (CPMT) (2007).
|
11 |
A -M. Yu, J. -K. Kim, M. -S. Kim and J. -H. Lee, "Characteristics of Sn-Ag-Cu-In Quaternary Solder Components and Reliability Evaluation of Solder Joints", Proc. International Conference on Soldering and Reliability (ICSR), Surface Mount Technology Association (SMTA) (2008).
|
12 |
A-Mi Yu, J. -K. Kim, J. -H. Lee and M. -S. Kim, "Pd-Doped Sn-Ag-Cu-In Solder Material for High Drop/Shock Reliability", Mater. Res. Bull., 45(3), 359 (2010).
DOI
ScienceOn
|
13 |
A -M. Yu, J. -W. Jang, J. -H. Lee, J. -K. Kim and M. -S. Kim, "Microstructure and Drop/Shock Reliability of a Sn-Ag-Cu- In Solder Joint with Increases in the Copper Content", Proc. 12th International Conference on EMAP, Singapore, 104, IEEE CPMT (2010).
|
14 |
A -M. Yu, J. -W. Jang, J. -K. Kim, J. -H. Lee and M. -S. Kim, "Improved Reliability of Sn-Ag-Cu-In Solder Alloy by the Addition of Minor Elements", Proc. 60th Electronic Components and Technology Conference (ECTC), Las Vegas, 1524, IEEE CPMT (2010).
|
15 |
J. -W. Jang, A -M. Yu, J. -H. Lee, C. -W. Lee and J. -K. Kim, "Solderability and BGA Joint Reliability of Sn-Ag-Cu-In- (Mn, Pd) Pb-Free Solders", J. Microelectron. Packag. Soc., 20(3), 53 (2013).
|