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| 1 |
Technology of Flexible Transparent Conductive Electrode for Flexible Electronic Devices
Kim, Joo-Hyun;Chon, Min-Woo;Choa, Sung-Hoon;
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The Korean Microelectronics and Packaging Society
, v.21, no.2, pp.1-11,
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| 2 |
Overview on Thermal Management Technology for High Power Device Packaging
Kim, Kwang-Seok;Choi, Don-Hyun;Jung, Seung-Boo;
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The Korean Microelectronics and Packaging Society
, v.21, no.2, pp.13-21,
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| 3 |
A study on Electrical Characteristic and Thermal Shock Property of TSV for 3-Dimensional Packaging
Jeong, Il Ho;Kee, Se Ho;Jung, Jae Pil;
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The Korean Microelectronics and Packaging Society
, v.21, no.2, pp.23-29,
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| 4 |
Thickness-dependent Electrical, Structural, and Optical Properties of ALD-grown ZnO Films
Choi, Yong-June;Kang, Kyung-Mun;Park, Hyung-Ho;
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The Korean Microelectronics and Packaging Society
, v.21, no.2, pp.31-35,
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| 5 |
Study of micro flip-chip process using ABL bumps
Ma, Junsung;Kim, Sungdong;Kim, Sarah Eunkyung;
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The Korean Microelectronics and Packaging Society
, v.21, no.2, pp.37-41,
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| 6 |
Thermal Analysis of 3D package using TSV Interposer
Suh, Il-Woong;Lee, Mi-Kyoung;Kim, Ju-Hyun;Choa, Sung-Hoon;
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The Korean Microelectronics and Packaging Society
, v.21, no.2, pp.43-51,
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| 7 |
Laser Drilling of High-Density Through Glass Vias (TGVs) for 2.5D and 3D Packaging
Delmdahl, Ralph;Paetzel, Rainer;
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The Korean Microelectronics and Packaging Society
, v.21, no.2, pp.53-57,
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| 8 |
High-Yield Etching-Free Transfer of Graphene: A Fracture Mechanics Approach
Yoon, Taeshik;Jo, Woo Sung;Kim, Taek-Soo;
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The Korean Microelectronics and Packaging Society
, v.21, no.2, pp.59-64,
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| 9 |
Warpage Characteristics Analysis for Top Packages of Thin Package-on-Packages with Progress of Their Process Steps
Park, D.H.;Jung, D.M.;Oh, T.S.;
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The Korean Microelectronics and Packaging Society
, v.21, no.2, pp.65-70,
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| 10 |
SiC based Technology for High Power Electronics and Packaging Applications
Sharma, Ashutosh;Lee, Soon Jae;Jang, Young Joo;Jung, Jae Pil;
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The Korean Microelectronics and Packaging Society
, v.21, no.2, pp.71-78,
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| 11 |
Fabrication of a Ultrathin Ag Film on a Thin Cu Film by Low-Temperature Immersion Plating in an Grycol-Based Solution
Kim, Ji Hwan;Cho, Young Hak;Lee, Jong-Hyun;
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The Korean Microelectronics and Packaging Society
, v.21, no.2, pp.79-84,
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| 12 |
A study on the Nano Wire Grid Polarizer Film by Magnetic Soft Mold
Jo, Sang-Uk;Chang, Sunghwan;Choi, Doo-Sun;Huh, Seok-Hwan;Jeong, Myung Yung;
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The Korean Microelectronics and Packaging Society
, v.21, no.2, pp.85-89,
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| 13 |
High-Speed Shear Test Characterization of Sn-Ag-Cu-In Quaternary Solder Joint
Kim, Ju-Hyung;Hyun, Chang-Yong;
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The Korean Microelectronics and Packaging Society
, v.21, no.2, pp.91-97,
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