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| 1 |
Reliability of Metal Electrode for Flexible Electronics
Kim, Byoung-Joon;
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The Korean Microelectronics and Packaging Society
, v.20, no.4, pp.1-6,
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| 2 |
Simulation of Ultrasonic Stress During Impact Phase in Wire Bonding
Mayer, Michael;
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The Korean Microelectronics and Packaging Society
, v.20, no.4, pp.7-11,
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| 3 |
Peel strengths of the Composite Structure of Metal and Metal Oxide Laminate
Shin, Hyeong-Won;Jung, Taek-Kyun;Lee, Hyo-Soo;Jung, Seung-Boo;
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The Korean Microelectronics and Packaging Society
, v.20, no.4, pp.13-16,
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| 4 |
Flip Chip Process on CNT-Ag Composite Pads for Stretchable Electronic Packaging
Choi, Jung Yeol;Oh, Tae Sung;
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The Korean Microelectronics and Packaging Society
, v.20, no.4, pp.17-23,
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| 5 |
Dielectric and Pyroelectric Properties of Lead-Free Sodium Bismuth Titanate Thin Films Due to Excess Sodium and Bismuth Addition
Kang, Dong Heon;Kang, Yong Hee;
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The Korean Microelectronics and Packaging Society
, v.20, no.4, pp.25-30,
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| 6 |
Cantilever Structural Analysis for Optimal Piezoelectric Power Harvesting
Lim, Geunsu;Joe, Sungsik;Kim, Suhyun;Park, Woo-Tae;
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The Korean Microelectronics and Packaging Society
, v.20, no.4, pp.31-34,
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| 7 |
A Four-point Bending Probe Station for Semiconductor Sensor Piezoresistance Measurement
Jeon, Ji Won;Kwon, Sung-Chan;Park, Woo-Tae;
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The Korean Microelectronics and Packaging Society
, v.20, no.4, pp.35-39,
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| 8 |
Criteria and Limitations for Power Rails Merging in a Power Distribution Network Design
Chew, Li Wern;
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The Korean Microelectronics and Packaging Society
, v.20, no.4, pp.41-45,
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| 9 |
A Study on the Electrical Characteristics of Different Wire Materials
Jeong, Chi-Hyeon;Ahn, Billy;Ray, Coronado;Kai, Liu;Hlaing, Ma Phoo Pwint;Park, Susan;Kim, Gwang;
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The Korean Microelectronics and Packaging Society
, v.20, no.4, pp.47-52,
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| 10 |
Comparisons of Interfacial Reaction Characteristics on Flip Chip Package with Cu Column BOL Enhanced Process (fcCuBE®) and Bond on Capture Pad (BOC) under Electrical Current Stressing
Kim, Jae Myeong;Ahn, Billy;Ouyang, Eric;Park, Susan;Lee, Yong Taek;Kim, Gwang;
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The Korean Microelectronics and Packaging Society
, v.20, no.4, pp.53-58,
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| 11 |
Impact of Copper Densities of Substrate Layers on the Warpage of IC Packages
Gu, SeonMo;Ahn, Billy;Chae, MyoungSu;Chow, Seng Guan;Kim, Gwang;Ouyang, Eric;
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The Korean Microelectronics and Packaging Society
, v.20, no.4, pp.59-63,
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| 12 |
Maskless Screen Printing Process using Solder Bump Maker (SBM) for Low-cost, Fine-pitch Solder-on-Pad (SoP) Technology
Choi, Kwang-Seong;Lee, Haksun;Bae, Hyun-Cheol;Eom, Yong-Sung;
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The Korean Microelectronics and Packaging Society
, v.20, no.4, pp.65-68,
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| 13 |
Analyzing the Impact of Supply Noise on Jitter in GBPS Serial Links on a Merged I/O-Core Power Delivery Network
Tan, Fern-Nee;Lee, Sheng Chyan;
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The Korean Microelectronics and Packaging Society
, v.20, no.4, pp.69-74,
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| 14 |
Power Distribution Network Modeling using Block-based Approach
Chew, Li Wern;
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The Korean Microelectronics and Packaging Society
, v.20, no.4, pp.75-79,
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| 15 |
Development of Cu CMP process for Cu-to-Cu wafer stacking
Song, Inhyeop;Lee, Minjae;Kim, Sungdong;Kim, Sarah Eunkyung;
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The Korean Microelectronics and Packaging Society
, v.20, no.4, pp.81-85,
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