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http://dx.doi.org/10.6117/kmeps.2013.20.4.035

A Four-point Bending Probe Station for Semiconductor Sensor Piezoresistance Measurement  

Jeon, Ji Won (Department of Mechanical and Automotive Engineering, Seoul National University of Science and Technology)
Kwon, Sung-Chan (Department of Mechanical and Automotive Engineering, Seoul National University of Science and Technology)
Park, Woo-Tae (Department of Mechanical and Automotive Engineering, Seoul National University of Science and Technology)
Publication Information
Journal of the Microelectronics and Packaging Society / v.20, no.4, 2013 , pp. 35-39 More about this Journal
Abstract
A four point bending apparatus has been developed to measure semiconductor sensor piezoresistance inside a four inch probe station. The apparatus has a footprint of $60{\times}83mm^2$ and can apply $10{\mu}m$ displacements using a vertical micrometer stage. We used finite element analysis to predict and improve the accuracy of the instrument. Finally strain gauge attached on a silicon test piece was used to experimentally verify the setup.
Keywords
Piezoresistance; Semiconductor sensor; 4 point bending; packaging;
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Times Cited By KSCI : 1  (Citation Analysis)
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