1 |
A.A. Barlian, W.-T. Park, J.R. Mallon, A.J. Rastegar Jr and B.L. Pruitt, "Review: semiconductor piezoresistance for microsystems", Proc. IEEE, 97 513 (2009).
DOI
ScienceOn
|
2 |
S.H. Bae, et al., "Graphene-based transparent strain sensor", Carbon, 51, 236 (2013).
DOI
ScienceOn
|
3 |
H Chung, C.-P. Tang, Y.-C. Chao, K.-F. Tseng, B.-J. Lwo, "Caibrate MOSFET Micro-Stress Sensors for Electronic Packaging", Proc. Electronics Packaging Technology Conference (EPTC), Singapore, 650 (2008).
|
4 |
J.-W. Kim, K.-S. Kim, H.-J. Lee, H.-Y. Kim, Y.-B. Park, and S. Hyun, "Characterization and observation of Cu-Cu Thermo-Compression Bonding using 4-point bending test system", J. Microelectron. Packag. Soc., 18(4), 11 (2011).
과학기술학회마을
|
5 |
E. Lund, T.G. Finstad, "Design and construction of a four-point bending based set-up for measurement of piezoresistance in semiconductors" Rev. Sci. Instrum. 75, 4960 (2004).
DOI
ScienceOn
|
6 |
R.E. Beaty, R.C. Jacger, J.C. Suhling, R.W. Johnson, R.D. Butler, "Evaluation of piezoresistive coefficient variation in silicon stress sensors using a four-point bending test fixture", IEEE Trans. Compd. Hybrids Manuf. Technol. 15, 904 (1992).
DOI
ScienceOn
|
7 |
M.A. Hopcroft, W.D. Nix, and T.W. Kenny, "What is the Young's Modulus of Silicon?", J. Microelectromech S. 19(2), 229 (2010).
DOI
ScienceOn
|
8 |
J.-K. Kim, E.-K. Lee, M.-S. Kim, J.-H. Lim, K.-H. Lee, and Y.-B. Park, "Interfacial Adhesion Energy of Ni-P Electroless-plating Contact for Buried Contact Silicon Solar Cell using 4-point Bending Test System", J. Microelectron. Packag. Soc., 19(1), 55 (2012).
과학기술학회마을
DOI
ScienceOn
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