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| 1 |
Market Environmental Conditions and Reliability Testing for Electronic Equipments
Tanaka, Hirokazu;Kim, Keun-Soo;
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The Korean Microelectronics and Packaging Society
, v.19, no.4, pp.1-5,
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| 2 |
Sn Whisker Research Trend in Japan
Kim, Keun-Soo;
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The Korean Microelectronics and Packaging Society
, v.19, no.4, pp.7-12,
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| 3 |
Optical Packaging and Interconnection Technology
Kim, Dong Min;Ryu, Jin Hwa;Jeong, Myung Yung;
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The Korean Microelectronics and Packaging Society
, v.19, no.4, pp.13-18,
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| 4 |
Developing Low Cost, High Throughput Si Through Via Etching for LED Substrate
Koo, Youngmo;Kim, GuSung;Kim, Sarah Eunkyung;
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The Korean Microelectronics and Packaging Society
, v.19, no.4, pp.19-23,
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| 5 |
Tin-Based Nanoparticles Prepared by a Wet Chemical Synthesis using Green Reducing and Capping Agents
Chee, Sang-Soo;Yun, Young-En;You, Eun-Sun;Park, Sang-Hyun;Park, Sung-Young;Lee, Seok-Hee;Park, In-Seon;Lee, Jong-Hyun;
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The Korean Microelectronics and Packaging Society
, v.19, no.4, pp.25-31,
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| 6 |
Analytical Quantification and Effect of Microstructure Development in Thick Film Resistor Processing
Lee, Byung Soo;
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The Korean Microelectronics and Packaging Society
, v.19, no.4, pp.33-37,
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| 7 |
Development of the Latest High-performance Acid Copper Plating Additives for Via-Filling & PTH
Nishiki, Shingo;
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The Korean Microelectronics and Packaging Society
, v.19, no.4, pp.39-43,
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| 8 |
DIMM-in-a-PACKAGE Memory Device Technology for Mobile Applications
Crisp, R.;
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The Korean Microelectronics and Packaging Society
, v.19, no.4, pp.45-50,
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| 9 |
Anisotropic Wet-Etching Process of Si Substrate for Formation of Thermal Vias in High-Power LED Packages
Yu, B.K.;Kim, M.Y.;Oh, T.S.;
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The Korean Microelectronics and Packaging Society
, v.19, no.4, pp.51-56,
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| 10 |
Effects of PCB Surface Finishes on Mechanical Reliability of Sn-1.2Ag-0.7Cu-0.4In Pb-free Solder Joint
Kim, Sung-Hyuk;Kim, Jae-Myeong;Yoo, Sehoon;Park, Young-Bae;
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The Korean Microelectronics and Packaging Society
, v.19, no.4, pp.57-64,
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| 11 |
Electrodeposition of Nano TiO2 Powder Dispersed Nickel Composite Coating
Park, So-Yeon;Lee, Jae-Ho;
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The Korean Microelectronics and Packaging Society
, v.19, no.4, pp.65-69,
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| 12 |
3D Integration using Bumpless Wafer-on-Wafer (WOW) Technology
Kim, Young Suk;
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The Korean Microelectronics and Packaging Society
, v.19, no.4, pp.71-78,
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| 13 |
Effects of ZnO Composition on the Thermal Emission Properties for LTCC Type of High Power LED Package
Kim, Woojeong;Kim, Hyung Soo;Shin, Daegyu;Lee, Hee Chul;
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The Korean Microelectronics and Packaging Society
, v.19, no.4, pp.79-83,
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