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| 1 |
Analysis of Void Effects on Mechanical Property of BGA Solder Joint
Lee, Jong-Gun;Kim, Kwang-Seok;Yoon, Jeong-Won;Jung, Seung-Boo;
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The Korean Microelectronics and Packaging Society
, v.18, no.4, pp.1-9,
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| 2 |
Characterization and observation of Cu-Cu Thermo-Compression Bonding using 4-point bending test system
Kim, Jae-Won;Kim, Kwang-Seop;Lee, Hak-Joo;Kim, Hee-Yeon;Park, Young-Bae;Hyun, Seung-Min;
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The Korean Microelectronics and Packaging Society
, v.18, no.4, pp.11-18,
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| 3 |
Reliability Improvement of Cu/Low K Flip-chip Packaging Using Underfill Materials
Hong, Seok-Yoon;Jin, Se-Min;Yi, Jae-Won;Cho, Seong-Hwan;Doh, Jae-Cheon;Lee, Hai-Young;
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The Korean Microelectronics and Packaging Society
, v.18, no.4, pp.19-25,
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| 4 |
Effect of PVP Molecular Weight on Size of Sn Nanoparticles Synthesized by Chemical Reduction
Jang, Nam-Ie;Lee, Jong-Hyun;
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The Korean Microelectronics and Packaging Society
, v.18, no.4, pp.27-32,
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| 5 |
Thermoelectric Properties of the p-type (Bi0.2Sb0.8)2Te3 with Variation of the Hot-Pressing Temperature
Choi, Jung-Yeol;Oh, Tae-Sung;
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The Korean Microelectronics and Packaging Society
, v.18, no.4, pp.33-38,
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| 6 |
Dispersion Method of Silica Nanopowders for Permalloy Composite Coating
Park, So-Yeon;Jung, Myung-Won;Lee, Jae-Ho;
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The Korean Microelectronics and Packaging Society
, v.18, no.4, pp.39-42,
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| 7 |
The Effects of Additives and Residual Stresses on the Electroless Nickel Plating on Carbon Substrate
Cheon, So-Young;Rhym, Young-Mok;Lee, Jae-Ho;
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The Korean Microelectronics and Packaging Society
, v.18, no.4, pp.43-48,
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| 8 |
High-Speed Cu Filling into TSV and Non-PR Bumping for 3D Chip Packaging
Hong, Sung-Chul;Kim, Won-Joong;Jung, Jae-Pil;
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The Korean Microelectronics and Packaging Society
, v.18, no.4, pp.49-53,
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| 9 |
Thermoelectric Properties of the Hot-pressed Bi2(Te0.9Se0.1)3 with Dispersion of Tungsten Powders
Roh, M.R.;Choi, J.Y.;Oh, T.S.;
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The Korean Microelectronics and Packaging Society
, v.18, no.4, pp.55-61,
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| 10 |
Effect of Glass Additions on the Adhesion and Electrical Conductivity of Photoimageable Silver Paste
Lee, Eun-Heay;Heo, Yu-Jin;Kim, Hyo-Tae;Kim, Jong-Hee;
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The Korean Microelectronics and Packaging Society
, v.18, no.4, pp.63-70,
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| 11 |
Evaluation of Solder Printing Efficiency with the Variation of Stencil Aperture Size
Kwon, Sang-Hyun;Kim, Jeong-Han;Lee, Chang-Woo;Yoo, Se-Hoon;
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The Korean Microelectronics and Packaging Society
, v.18, no.4, pp.71-77,
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| 12 |
Preparation and Characterization of White Phosphorescence Polymer Light Emitting Diodes Using PFO:Ir(ppy)3:MDMO-PPV Emission Layer
Park, Byung-Min;Chang, Ho-Jung;
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The Korean Microelectronics and Packaging Society
, v.18, no.4, pp.79-83,
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| 13 |
Failure Mechanism and Test Method for Reliability Standardization of Solder Joints
Kim, Kang-Dong;Huh, Seok-Hwan;Jang, Joong-Soon;
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The Korean Microelectronics and Packaging Society
, v.18, no.4, pp.85-90,
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| 14 |
Design of Structure for High-Efficiency LEDs on Patterned Sapphire Substrate
Kang, Ho-Ju;Song, Hui-Young;Jeong, Myung-Yung;
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The Korean Microelectronics and Packaging Society
, v.18, no.4, pp.91-95,
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