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| 1 |
Development of Knowledge Sharing Platform for Digitization of Surface Mount Technology
Bae, Sung-Min;Son, Soo-Hyun;Kwon, Sang-Hyun;Lee, Hyo-Soo;Heo, Young-Moo;Kang, Mun-Jin;Yoo, Se-Hoon;
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The Korean Microelectronics and Packaging Society
, v.18, no.1, pp.1-5,
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| 2 |
Optical PCB and Packaging Technology
Ryu, Jin-Hwa;Kim, Dong-Min;Kim, Eung-Soo;Jeong, Myung-Yung;
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The Korean Microelectronics and Packaging Society
, v.18, no.1, pp.7-13,
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| 3 |
Evaluation of Flexural Strength of Silicon Die with Thickness by 4 Point Bending Test
Min, Yoon-Ki;Byeon, Jai-Won;
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The Korean Microelectronics and Packaging Society
, v.18, no.1, pp.15-21,
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| 4 |
Optimization of Electrochemical Etching Parameters in Porous Silicon Layer Transfer Process for Thin Film Solar Cell
Lee, Ju-Young;Koo, Yeon-Soo;Lee, Jae-Ho;
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The Korean Microelectronics and Packaging Society
, v.18, no.1, pp.23-27,
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| 5 |
The Effect of Additives on the High Current Density Copper Electroplating
Shim, Jin-Yong;Moon, Yun-Sung;Hur, Ki-Su;Koo, Yeon-Soo;Lee, Jae-Ho;
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The Korean Microelectronics and Packaging Society
, v.18, no.1, pp.29-33,
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| 6 |
Shearing Characteristics of Sn3.0AgO.5Cu Solder Ball for Standardization of High Speed Shear Test
Jung, Do-Hyun;Lee, Young-Gon;Jung, Jae-Pil;
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The Korean Microelectronics and Packaging Society
, v.18, no.1, pp.35-39,
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| 7 |
Ultra-Wide-Band (UWB) Band-Pass-Filter for Wireless Applications from Silicon Integrated Passive Device (IPD) Technology
Lee, Yong-Taek;Liu, Kai;Frye, Robert;Kim, Hyun-Tai;Kim, Gwang;Aho, Billy;
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The Korean Microelectronics and Packaging Society
, v.18, no.1, pp.41-47,
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| 8 |
Property Variation of Diamond-like Carbon Thin Film According to the Annealing Temperature
Park, Ch.S.;Koo, K.H.;Park, H.H.;
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The Korean Microelectronics and Packaging Society
, v.18, no.1, pp.49-53,
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| 9 |
Relationship between Tensile Characteristics and Fatigue Failure by Folding or Bending in Cu Foil on Flexible Substrate
Kim, Byoung-Joon;Jeong, Myeong-Hyeok;Hwang, Sung-Hwan;Lee, Ho-Young;Lee, Sung-Won;Cbun, Ki-Do;Park, Young-Bae;Joo, Young-Cbang;
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The Korean Microelectronics and Packaging Society
, v.18, no.1, pp.55-59,
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