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http://dx.doi.org/10.6117/kmeps.2011.18.1.055

Relationship between Tensile Characteristics and Fatigue Failure by Folding or Bending in Cu Foil on Flexible Substrate  

Kim, Byoung-Joon (School of Materials Science and Engineering, Seoul National University)
Jeong, Myeong-Hyeok (School of Materials Science and Engineering, Andong National University)
Hwang, Sung-Hwan (School of Materials Science and Engineering, Seoul National University)
Lee, Ho-Young (School of Materials Science and Engineering, Seoul National University)
Lee, Sung-Won (R&D Center, LG Innotek Co., Ltd.)
Cbun, Ki-Do (R&D Center, LG Innotek Co., Ltd.)
Park, Young-Bae (School of Materials Science and Engineering, Andong National University)
Joo, Young-Cbang (School of Materials Science and Engineering, Seoul National University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.18, no.1, 2011 , pp. 55-59 More about this Journal
Abstract
Folding endurance, bending fatigue and monotonic tensile tests of 4 kinds of Cu foil on flexible substrate was performed to investigate the relationship between folding or bending endurances and tensile characteristics. The repeated 5.3 or 2.0% strain was applied to Cu foil in folding endurance test or bending fatigue test while monitoring the electrical resistance. Elastic modulus, yield strength, ultimate tensile strength, ductility, and toughness were obtained by monotonic tensile test on the same samples. The Cu foil with higher toughness and ductility showed higher reliabilities in folding or bending fatigue. However, elastic modulus and yield strength did not show any relationship with folding and bending reliability. This is because the failures of Cu foil by folding or bending fatigue were closely related to the fracture energy of metal.
Keywords
Flexible; folding endurance test; bending endurance test; electrical resistance;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
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