|
| 1 |
Regulation in Shear Test Method for BGA of Flip-chip Packages
Ahn, Jee-Hyuk;Kim, Kwang-Seok;Lee, Young-Chul;Kim, Yong-Il;Jung, Seung-Boo;
/
The Korean Microelectronics and Packaging Society
, v.17, no.3, pp.1-9,
|
|
| 2 |
Thermo-compression Bonding of Electrodes between RPCB and FPCB using Sn-Pb Solder
Choi, Jung-Hyun;Lee, Jong-Gun;Yoon, Jeong-Won;Jung, Seung-Boo;
/
The Korean Microelectronics and Packaging Society
, v.17, no.3, pp.11-15,
|
|
| 3 |
Thermo-mechanical Behavior of WB-PBGA Packages with Pb-Sn Solder and Lead-free Solder Using Moire Interferometry
Lee, Bong-Hee;Kim, Man-Ki;Joo, Jin-Won;
/
The Korean Microelectronics and Packaging Society
, v.17, no.3, pp.17-26,
|
|
| 4 |
Thermal Cycling and High Temperature Storage Reliabilities of the Flip Chip Joints Processed Using Cu Pillar Bumps
Kim, M.Y.;Lim, S.K.;Oh, T.S.;
/
The Korean Microelectronics and Packaging Society
, v.17, no.3, pp.27-32,
|
|
| 5 |
Microstructural Study of Creep-Fatigue Crack Propagation for Sn-3.0Ag-0.5Cu Lead-Free Solder
Woo, Tae-Wuk;Sakane, Masao;Kobayashi, Kaoru;Park, Hyun-Chul;Kim, Kwang-Soo;
/
The Korean Microelectronics and Packaging Society
, v.17, no.3, pp.33-41,
|
|
| 6 |
Electrical Characteristics of Copper Circuit using Inkjet Printing
Kim, Kwang-Seok;Koo, Ja-Myeong;Joung, Jae-Woo;Kim, Byung-Sung;Jung, Seung-Boo;
/
The Korean Microelectronics and Packaging Society
, v.17, no.3, pp.43-49,
|
|
| 7 |
Thermoelectric Characteristics of the p-type _2Te_3$} "$(Bi,Sb)_2Te_3$") Nano-Bulk Hot-Pressed with Addition of  as Nano Inclusions
Yeo, Y.H.;Kim, M.Y.;Oh, T.S.;
/
The Korean Microelectronics and Packaging Society
, v.17, no.3, pp.51-57,
|
|
| 8 |
Effects of Nano-sized Diamond on Wettability and Interfacial Reaction for Immersion Sn Plating
Yu, A-Mi;Kang, Nam-Hyun;Lee, Kang;Lee, Jong-Hyun;
/
The Korean Microelectronics and Packaging Society
, v.17, no.3, pp.59-63,
|
|
| 9 |
The Effects of UBM and SnAgCu Solder on Drop Impact Reliability of Wafer Level Package
Kim, Hyun-Ho;Kim, Do-Hyung;Kim, Jong-Bin;Kim, Hee-Jin;Ahn, Jae-Ung;Kang, In-Soo;Lee, Jun-Kyu;Ahn, Hyo-Sok;Kim, Sung-Dong;
/
The Korean Microelectronics and Packaging Society
, v.17, no.3, pp.65-69,
|
|
| 10 |
Effects of PEO Conditions on Surface Properties of AZ91 Mg Alloy
Park, Kyeong-Jin;Jung, Myung-Won;Lee, Jae-Ho;
/
The Korean Microelectronics and Packaging Society
, v.17, no.3, pp.71-77,
|
|
| 11 |
Copper Filling to TSV (Through-Si-Via) and Simplification of Bumping Process
Hong, Sung-Jun;Hong, Sung-Chul;Kim, Won-Joong;Jung, Jae-Pil;
/
The Korean Microelectronics and Packaging Society
, v.17, no.3, pp.79-84,
|
|