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| 1 |
Interfacial Reaction Characteristics of a Bi-20Sb-10Cu-0.3Ni Pb-free Solder Alloy on Cu Pad
Kim, Ju-Hyung;Hyun, Chang-Yong;Lee, Jong-Hyun;
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The Korean Microelectronics and Packaging Society
, v.17, no.1, pp.1-7,
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| 2 |
Pin Pull Characteristics of Pin Lead with Variation of Mechanical Properties of Pin Lead in PGA (Pin Grid Array) Package
Cho, Seung-Hyun;Choi, Jin-Won;Park, Gyun-Myoung;
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The Korean Microelectronics and Packaging Society
, v.17, no.1, pp.9-17,
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| 3 |
Properties of Ga-doped ZnO transparent conducting oxide fabricated on PET substrate by RF magnetron sputtering
Kim, Jeong-Yeon;Kim, Byeong-Guk;Lee, Yong-Koo;Kim, Jae-Hwa;Woo, Duck-Hyun;Kweon, Soon-Yong;Lim, Dong-Gun;Park, Jae-Hwan;
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The Korean Microelectronics and Packaging Society
, v.17, no.1, pp.19-24,
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| 4 |
Study on Thermal Stability of the Interface between Electroless Ni-W-P Deposits and BGA Lead-Free Solder (Sn-3.0Ag-0.5Cu)
Shin, Dong-Hee;Cho, Jin-Ki;Kang, Seung-Goon;
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The Korean Microelectronics and Packaging Society
, v.17, no.1, pp.25-31,
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| 5 |
Recent Advances in Eco-friendly Nano-ink Technology for Display and Semiconductor Application
Kim, Jong-Woong;Hong, Sung-Jei;Kim, Young-Seok;Kim, Young-Sung;Lee, Jeong-No;Kang, Nam-Kee;
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The Korean Microelectronics and Packaging Society
, v.17, no.1, pp.33-39,
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| 6 |
Interfacial Adhesion between Screen-Printed Ag and Epoxy Resin-Coated Polyimide
Park, Sung-Cheol;Kim, Jae-Won;Kim, Ki-Hyun;Park, Se-Ho;Lee, Young-Min;Park, Young-Bae;
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The Korean Microelectronics and Packaging Society
, v.17, no.1, pp.41-46,
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| 7 |
An Analysis of Screen Printing using Solder Paste
Seo, Won-Sang;Min, Byung-Wook;Kim, Jong-Ho;Lee, Nak-Kyu;Kim, Jong-Bong;
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The Korean Microelectronics and Packaging Society
, v.17, no.1, pp.47-53,
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| 8 |
Standardization of Bending Impact Test Methods of Sn-Ag-Cu Lead Free Solder Ball
Jang, Im-Nam;Park, Jai-Hyun;Ahn, Yong-Sik;
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The Korean Microelectronics and Packaging Society
, v.17, no.1, pp.55-61,
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| 9 |
The Effects of Pretreatment and Surfactants on CNT and Permalloy Composite Electroplating
Um, Ho-Kyung;Lee, Heung-Yeol;Yim, Tai-Hong;Lee, Jae-Ho;
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The Korean Microelectronics and Packaging Society
, v.17, no.1, pp.63-68,
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| 10 |
Thermo-Mechanical Analysis of Though-silicon-via in 3D Packaging
Hwang, Sung-Hwan;Kim, Byoung-Joon;Jung, Sung-Yup;Lee, Ho-Young;Joo, Young-Chang;
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The Korean Microelectronics and Packaging Society
, v.17, no.1, pp.69-73,
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| 11 |
Electroless Nickel Plating on Porous Carbon Substrate
Chun, So-Young;Rhyim, Young-Mok;Kim, Doo-Hyun;Lee, Jae-Ho;
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The Korean Microelectronics and Packaging Society
, v.17, no.1, pp.75-80,
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| 12 |
Effect of PCB Surface Finishs on Intermetallic Compound Growth Kinetics of Sn-3.0Ag-0.5Cu Solder Bump
Jeong, Myeong-Hyeok;Kim, Jae-Myeong;Yoo, Se-Hoon;Lee, Chang-Woo;Park, Young-Bae;
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The Korean Microelectronics and Packaging Society
, v.17, no.1, pp.81-88,
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