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The Effects of Pretreatment and Surfactants on CNT and Permalloy Composite Electroplating  

Um, Ho-Kyung (Dept. of Materials Science and Engineering, Hongik University)
Lee, Heung-Yeol (Div. of Prod. Tech., Korea Institute of Industrial Technology)
Yim, Tai-Hong (Div. of Prod. Tech., Korea Institute of Industrial Technology)
Lee, Jae-Ho (Dept. of Materials Science and Engineering, Hongik University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.17, no.1, 2010 , pp. 63-68 More about this Journal
Abstract
CNT and permalloy composite plating was investigated. CNTs were pretreated prior to electroplating to disassemble the tangled CNT lumps. The ball milling as a physical pretreatment and the acid treatment as a chemical pretreatment were used. 10M nitric acid and 10 M sulfuric acid were used for the chemical pretreatment. Sulfuric acid was more effective than nitric acid to disassemble CNT lumps. To disperse CNT in the solution, surfactants were used. SDS, Triton X-100 and PAA were used for this purpose. More CNTs were incorporated in permalloy coating when PAA was used as a surfactant. The surface morphologies were observed with FESEM after electroplating CNT and permalloy. The current densities were varied from 10 to $80\;mA/cm^2$ and the concentration of PAA was fixed at 2 g/L. The optimum current density without surface cracks was $20\;mA/cm^2$. The crystallinity of the deposit was analyzed with XRD and the surface hardness was analyzed with Vicker's hardness tester. The corrosion behavior was analyzed with polarization plot. The physical properties of permalloy were not improved with CNT composite plating.
Keywords
CNT; permalloy; composite; electroplating;
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Times Cited By KSCI : 2  (Citation Analysis)
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