1 |
Korhonen, M.A., Borgesen, P., Tu, K.N. and Li, C.Y., "Effects of microstructure on the formation, shape, and motion of voids during electromigration in passivated copper interconnects", J. Appl. Phys. vol.73, p.3790, 1993.
DOI
|
2 |
M. Hauschildt, M. Gall, S. Thrasher, P. Justison, L. Michaelson, R. Hernandez, H. Kawasaki and P. Ho, "Statistical Analysis of Electromigration Lifetimes and Void Evolution for Cu Interconnects", MRS Symposium Proceedings, vol. 812, p.379, 2004.
|
3 |
Herring, C., "Diffusional viscosity of a polycrystalline solid", J. Appl. Phys., vol. 21, p. 437, 1950.
DOI
|
4 |
Ashby, M.F., "A first report on deformation -mechanism maps", Acta Metallurgica vol. 20 p. 887, 1972.
DOI
|
5 |
Mohamed, F.A. and T.G. Langdon, "Deformation mechanism maps based on grain size", Met. Trans. vol.5 p. 2339, 1974.
DOI
|
6 |
Rzepka, S., Korhonen, M.A., Weber, E.R. and Li, C.-Y., "Three-Dimensional Finite Element Simulation of Electro and Stress Migration Effects in Interconnect Lines", Mat. Res. Soc. Symp. Proc. vol. 473, p. 329, 1997.
|
7 |
Clement, J.J. and Thompson, C.V., "Modeling Electromigration-Induced Stress Evolution in Confined Metal Lines", J. Appl. Phys., vol. 78, no. 2, pp. 900-904, 1995.
DOI
|
8 |
Clement, J.J., "Reliability Analysis for Encapsulated Interconnect Lines Under DC and Pulsed DC Current Using a Continuum Electromigration Transport Model", J. Appl. Phys., vol. 82, no. 12, pp. 5991-6000, 1997.
DOI
|
9 |
Carslaw, H.S. and Jaeger, J.C., "Conduction of Heat in Solids", Clarendon, Oxford, 1947.
|
10 |
Balluffi, R.W. and Granato, A.V., "Dislocations, Vacancies and Interstitials," in Dislocation in Solids, edited by F.N.R. Nabarro, pp. 1-133, 1979.
|