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Deformation and stress analysis of Vertical form-fill-seal machine  

Baek, Seung-Yub (Department of Mechanical Design, Induk University)
Choi, Seung-Geon (Department of Mechanical Engineering, Inha University)
Jung, Yeon-Seung (Department of Metallic Molding Design, Yuhan University)
Jang, Young-Ju (Woori Elec Co., Ltd.)
Publication Information
Design & Manufacturing / v.10, no.1, 2016 , pp. 46-50 More about this Journal
Abstract
Beverage industry is the largest in the domestic packaging market. Usually, beverage is packed in palstic, glass, can and paper bags. However, the cost of these packaging methods are very high and the recycling are not easy to handle. Pouch packaging method is one of the packaging method to solve the drawbacks of former beverage containers. The pouch packaging methods are difficult to control, it requires a number of processes. A vertical form-fill-seal machine which is self-developed is the capable of processing in a single apparatus. In this paper, in order to develop a pouch equipment, the structure analysis was carried out for the main unit. The stress and deformation of feed unit which removes the air inside the pouch while feeding down has been analyzed. It receives the greatest impact from the rolling part. And also, the sealing unit has been analyzed. The analysis result shows that the stress and the deformation was slight to be applicable to the actual system.
Keywords
Vertical form-fill-seal machine; Pouch packaging; Deformation analysis; Stress analysis; sealing;
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  • Reference
1 B. Bai, L.X. Zhang, T. Guo, C. Q. Liu, "Analysis of dynamic characteristics of the main shaft system in a hydro-trubine based on ANSYS", International conference on advances in computational modeling and simulation, 31, pp. 654-658, 2012.
2 김광준, 이원학, "스토케스틱 방법에 의한 공작기계의 안정성 해석", 한국정밀공학회, pp. 34-49, 1984.
3 김기만, 최성대, 허빈, 홍종필, 이달식, "지능형 공작기계 베드의 구조물 해석", 한국기계가공학회, pp. 189-190, 2010.
4 최승건, 김성현, 최웅걸, 이은상, 최지훈, 이석주, 김규동, "차세대 하이브리드 수직형 복합 연삭 시스템의 개발", 한국정밀공학회, pp. 1139-1145 2013.   DOI