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1 |
The Separation Behaviors from Assemble Conditions for Pitch 1.25mm Level Wire to Board Connector
Heo, Young-Moo;Yoon, Gil-Sang;
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Korean Society of Die & Mold Engineering
, v.10, no.1, pp.1-6,
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2 |
A Study on rib sink-marks of injection mold for unpainted parts
Ro, Young-Soo;Lim, Jea-Kui;Rhu, Ho-yeun;Lee, Hee-Jin;Hwang, Si-Hyon;
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Korean Society of Die & Mold Engineering
, v.10, no.1, pp.7-11,
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3 |
A study on equal-channel angular extrusion process conditions for improving mechanical properties of magnesium alloy
Bae, Seong-Hwan;Min, Kyung Ho;
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Korean Society of Die & Mold Engineering
, v.10, no.1, pp.12-18,
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4 |
A Study on the Bend Deformation Cause Analysis of CAE Applied Wire to Board Connectors
Jeon, Yong-Jun;Shin, Kwang-Ho;Heo, Young-Moo;
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Korean Society of Die & Mold Engineering
, v.10, no.1, pp.19-25,
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5 |
A Study on the impact on the quality of hemming the number of hemming process
Shin, Na-Eun;Choi, Moon-Ho;Choi, Young-Deok;Choi, Hae-Un;Jang, Rae-Seong;Choi, Kye-Kwang;Kim, Sei-Hwan;Yun, Jae-Woong;Lee, Chun-Kyu;
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Korean Society of Die & Mold Engineering
, v.10, no.1, pp.26-30,
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6 |
A Numerical Study on formability improvement by adjusting blank holding force
Choi, Hyun-Seok;Chung, Wan-jin;
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Korean Society of Die & Mold Engineering
, v.10, no.1, pp.31-35,
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7 |
A Study on the Effects of Concave Shaping in Improving Contract Pressure for Planar Array Connector Terminal Pins
Jeon, Yong-Jun;Shin, Kwang-Ho;Heo, Young-Moo;
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Korean Society of Die & Mold Engineering
, v.10, no.1, pp.36-40,
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8 |
A Study on the impact on the quality of hemming the number of hemming process
Lee, Je-Duk;Park, Jong-Sik;Im, Jae-Guk;Park, Dong-Hee;Park, Min-Ho;Choi, Kye-Kwang;Kim, Sei-Hwan;Yun, Jae-Woong;Lee, Chun-Kyu;
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Korean Society of Die & Mold Engineering
, v.10, no.1, pp.41-45,
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9 |
Deformation and stress analysis of Vertical form-fill-seal machine
Baek, Seung-Yub;Choi, Seung-Geon;Jung, Yeon-Seung;Jang, Young-Ju;
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Korean Society of Die & Mold Engineering
, v.10, no.1, pp.46-50,
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10 |
A Study of Semi Fine-blanking Mold Analysis using Finite Element Method
Lee, Sang-Hun;Song, Gi-Hwan;Son, Chang-Woo;Seo, Hyoung-Jin;Seo, Tae-Il;
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Korean Society of Die & Mold Engineering
, v.10, no.1, pp.51-54,
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