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The Separation Behaviors from Assemble Conditions for Pitch 1.25mm Level Wire to Board Connector  

Heo, Young-Moo (Department of Dies & Molds Research Group, Korea Institute of Industrial Technology)
Yoon, Gil-Sang (Department of Dies & Molds Research Group, Korea Institute of Industrial Technology)
Publication Information
Design & Manufacturing / v.10, no.1, 2016 , pp. 1-6 More about this Journal
Abstract
In this study, the modification structure design of insulation displacement connector developed was considered for simplification of assembly process. The modified connector consisted terminal, wafer and fitting nails. The separation behavior under locking condition for pitch 1.25mm wire to board connector was measured and the apparatus for the test was made. The maximum restraining force was measured about 4.5kgf that was bigger value than the specification limit. And the pulling force of a wire was also indicated about 2.3kgf.
Keywords
Separation Behavior; Locking; Wire to Board Connector; Tensile Test; Apparatus;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
연도 인용수 순위
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