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http://dx.doi.org/10.7736/KSPE.2017.34.2.101

Effect of Slurry Flow in Spray Slurry Nozzle System on Cu CMP  

Lee, Da Sol (Department of Mechanical Engineering, Pusan National University)
Jeong, Seon Ho (Department of Mechanical Engineering, Pusan National University)
Lee, Jong Woo (Department of Mechanical Engineering, Pusan National University)
Jeong, Jin Yeop (Department of Mechanical Engineering, Pusan National University)
Jeong, Hae Do (Department of Mechanical Engineering, Pusan National University)
Publication Information
Journal of the Korean Society for Precision Engineering / v.34, no.2, 2017 , pp. 101-106 More about this Journal
Abstract
The chemical mechanical planarization (CMP) process combines the chemical effect of slurry with the mechanical effect of abrasive (slurry)-wafer-pads The slurry delivery system has a notable effect on polishing results, because the slurry distribution is changed by the supply method. Thus, the investigation of slurry pumps and nozzles with regard to the slurry delivery system becomes important. This paper investigated the effect of a centrifugal slurry pump on a spray nozzle system in terms of uniform slurry supply under a rotating copper (Cu) wafer, based on experimental results and computational fluid dynamics (CFD). In conventional tools, the slurry is unevenly and discontinuously supplied to the pad, due to a pulsed flow caused by the peristaltic pump and distributed in a narrow area by the tube nozzle. Adopting the proposed slurry delivery system provides a higher uniformity and lowered shear stress than usual methods. Therefore, the newly developed slurry delivery system can improve the CMP performance.
Keywords
Chemical mechanical polishing; Centrifugal pump; Slurry delivery system; Slurry flow; Spray slurry nozzle;
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Times Cited By KSCI : 1  (Citation Analysis)
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