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Sensitivity of Electroplating Conditions on Young's Modulus of Thin Film  

Kim, Sang-Hyun (한성대학교 기계시스템공학과)
Publication Information
Journal of the Korean Society for Precision Engineering / v.25, no.8, 2008 , pp. 88-95 More about this Journal
Abstract
Young's modulus of electroplated nickel thin film is systematically investigated using the resonance method of atomic force microscope. Thin layers of nickel to be measured are electroplated onto the surface of an AFM silicon cantilever and Young's modulus of plated nickel film is investigated as a function of process conditions such as the plating temperature and applied current density. It is found that Young's modulus of plated nickel thin film is as high as that of bulk nickel at low plating temperature or low current density, but decreases with increasing plating temperature or current density. The results imply that the plating rate increases as increasing the plating temperature or current density, therefore, slow plating rate produces a dense plating material due to the sufficient time fur nickel ions to form a dense coating.
Keywords
Atomic Force Microscope (AFM); Young's modulus; Thin film; Current density; Resonant method;
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