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| 1 |
Overview of 3-D IC Design Technologies for Signal Integrity (SI) and Power Integrity (PI) of a TSV-Based 3D IC
Kim, Joohee;Kim, Joungho;
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The Korean Institute of Electromagnetic Engineering and Science
, v.24, no.2, pp.3-14,
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| 2 |
State-of-the-Art mmWave Antenna Packaging Methodologies
Hong, Wonbin;
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The Korean Institute of Electromagnetic Engineering and Science
, v.24, no.2, pp.15-22,
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| 3 |
State of The Art in Semiconductor Package for Mobile Devices
Kim, Jin Young;Lee, Seung Jae;
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The Korean Institute of Electromagnetic Engineering and Science
, v.24, no.2, pp.23-34,
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| 4 |
Effects of Mesh Planes on Signal Integrity in Glass Ceramic Packages for High-Performance Servers
Choi, Jinwoo;Altabella Lazzi, Dulce M.;Becker, Wiren D.;
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The Korean Institute of Electromagnetic Engineering and Science
, v.24, no.2, pp.35-50,
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| 5 |
Through Silicon Stack (TSS) Assembly for Wide IO Memory to Logic Devices Integration and Its Signal Integrity Challenges
Shin, Jaemin;Kim, Dong Wook;
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The Korean Institute of Electromagnetic Engineering and Science
, v.24, no.2, pp.51-57,
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| 6 |
광 인터커넥터 기술 동향
Lee, Myeong-Hyeon;Kim, Min-Su;
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The Korean Institute of Electromagnetic Engineering and Science
, v.24, no.2, pp.66-73,
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| 7 |
전파 교육의 현대화 필요성
Lee, Haeng-Seon;
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The Korean Institute of Electromagnetic Engineering and Science
, v.24, no.2, pp.82-86,
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