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1 |
Surface Preparation and Activation Only by Abrasion and Its Effect on Adhesion Strength
Ali Gursel;Salih Yildiz;
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The Society of Adhesion and Interface, Korea
, v.23, no.4, pp.101-107,
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2 |
Adhesive Properties of Epoxy Composite According to the Surface Treatment of Cu Substrate and Adhesion Promoter Content
Eun-jin Kim;Jung Soo Kim;Young-Wook Chang;Dong Hyun Kim;
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The Society of Adhesion and Interface, Korea
, v.23, no.4, pp.108-115,
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3 |
Cost-Effective Soft Lithography of Organic Semiconductors in OFETs with Compact Discs as Master Molds
Sejin Park;Hyukjin Kim;Tae Kyu An;
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The Society of Adhesion and Interface, Korea
, v.23, no.4, pp.116-121,
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4 |
A Study on the Plasma Treatment Effect of Metal Fibersusing Micromechanical Technique
MiYeon Kwon;Seung Goo Lee;
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The Society of Adhesion and Interface, Korea
, v.23, no.4, pp.122-129,
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5 |
Morphology Control of Active Layers for Efficient Organic Indoor Photovoltaics
Yongchan Jang;Soyoung Kim;Jeonga Kim;Jongbok Kim;Wonho Lee;
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The Society of Adhesion and Interface, Korea
, v.23, no.4, pp.130-136,
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6 |
Synthesis of UV Curable Polyurethane Adhesives Based on Various Compositions of Mixed Polyol with Improved Adhesion and Flexural Properties
Won-Young Lee;Soo-Yong Park;Guni Kim;Ildoo Chung;
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The Society of Adhesion and Interface, Korea
, v.23, no.4, pp.137-143,
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