Browse > Article
http://dx.doi.org/10.14775/ksmpe.2021.20.05.121

A Study on the Selection of Highly Flexible Blanket for Reverse Offset Printing  

Shin, Seunghang (Department of Smart Manufacturing Engineering, Changwon National University)
Kim, Seok (Department of Smart Manufacturing Engineering, Changwon National University)
Cho, Young Tae (Department of Smart Manufacturing Engineering, Changwon National University)
Publication Information
Journal of the Korean Society of Manufacturing Process Engineers / v.20, no.5, 2021 , pp. 121-127 More about this Journal
Abstract
Reverse offset printing is considering as an emerging technology for printed electronics owing to its environmentally friendliness and cost-effectiveness. In reverse offset printing, selecting the materials for cliché and blanket is critical because of its minimum resolution, registration errors, aspect ratio of reliefs, pattern area, and reusability. Various materials such as silicon, quartz, glass, electroplated nickel plates, and imprinted polymers on rigid substrates can be used for the reverse offset printing of cliché. However, when new structures are designed for specific applications, new clichés need to re-fabricated each time employing multiple time-consuming and costly processes. Therefore, by modifying the blanket materials containing the printing ink, several new structures can be easily created using the same cliché. In this study, we investigated various elastomeric materials and evaluated their applicability for designing a highly stretchable blanket with controlled elastic deformation to implement tunable reverse offset printing.
Keywords
Printed Electronics; Reverse Offset Printing; Flexibility; Stretchable Blanket;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 Nguyen, P. Q., Yeo, L. P., Lok, B. K., and Lam, Y. C., "Patterned surface with controllable wettability for inkjet printing of flexible printed electronics," ACS Applied Materials & Interfaces, Vol. 6. No. 6, pp. 4011-4016, 2014.   DOI
2 Sowade, E., Polomoshnov, M., Willert, A., & Baumann, R. R., "Toward 3D-Printed Electronics: Inkjet-Printed Vertical Metal Wire Interconnects and Screen-Printed Batteries," Advanced Engineering Materials, Vol. 21, No. 10, pp. 1900568, 2019.   DOI
3 Bevione, M., and Chiolerio, A., "Benchmarking of inkjet printing methods for combined throughput and performance," Advanced Engineering Materials, Vol. 22, No. 12, pp. 2000679, 2020.   DOI
4 Kusaka, Y., Fukuda, N., and Ushijima, H., "Recent advances in reverse offset printing: an emerging process for high-resolution printed electronics," Japanese Journal of Applied Physics, Vol. 59, pp. SG0802, 2020.   DOI
5 Can, T. T. T., Nguyen, T. C., and Choi, W. S., "High-Viscosity Copper Paste Patterning and Application to Thin-Film Transistors Using Electrohydrodynamic Jet Printing," Advanced Engineering Materials, Vol. 22, No. 3, pp. 1901384, 2020.   DOI
6 Zhong, Z., Ko, P., Seok, J. Y., Kim, H., Kwon, S., Youn, H., and Woo, K., "Roll-to-Roll Reverse -Offset Printing Combined with Photonic Sintering Process for Highly Conductive Ultrafine Patterns," Advanced Engineering Materials, Vol. 22, No. 10, pp. 2000463, 2020.   DOI
7 Park, J. and Lee, C., "A Statistical Analysis for Slot-die Coating Process in Roll-to-roll Printed Electronics," Journal of the Korean Society of Manufacturing Process Engineers, Vol. 12, No. 5, pp. 23-29, 2013.   DOI
8 Lee, J. and Lee, C., "Analysis of Thermal Effect on Tension of a Moving Web in Roll-to-Roll Printed Electronics," Journal of the Korean Society of Manufacturing Process Engineers, Vol. 12, No. 5, pp. 9-15, 2013.
9 Hubler, A. C., Schmidt, G. C., Kempa, H., Reuter, K., Hambsch, M., and Bellmann, M., "Three-dimensional integrated circuit using printed electronics," Organic Electronics, Vol. 12, No. 3, pp. 419-423, 2011.   DOI
10 Kravchuk, O., Lesyuk, R., Bobitski, Y., & Reichenberger, M., "Sintering Methods of Inkjet-Printed Silver Nanoparticle Layers," International Conference on Nanotechnology and Nanomaterials, pp. 317-339, 2017.
11 Lee, H., Seong, B., Moon, H., and Byun, D., "Directly printed stretchable strain sensor based on ring and diamond shaped silver nanowire electrodes," Rsc Advances, Vol. 5, No. 36, pp. 28379-28384, 2015.   DOI
12 Pandey, M., Wang, Z., Kapil, G., Baranwal, A. K., Hirotani, D., Hamada, K., and Hayase, S., "Dependence of ITO Coated Flexible Substrates in the Performance and Bending Durability of Perovskite Solar Cells," Advanced Engineering Materials, Vol. 21, No. 8, pp. 1900288, 2019.   DOI
13 Yun, Y. H, Jang, S. A. and Oh, Y. J., "Formation of Stretchable Metal Bi-Layer Interconnects using a Deformed Elastomeric Polymer Substrate," Korean Journal of Metals and Materials, Vol. 51, No. 2, pp. 151-158, 2013.   DOI
14 Stach, M., Chang, E. C., Yang, C. Y., and Lo, C. Y., "Post-lithography pattern modification and its application to a tunable wire grid polarizer," Nanotechnology, Vol. 24, No. 11, pp. 115306, 2013.   DOI
15 Choi, Y. M., Lee, E. S., Lee, T. M., and Kim, K. Y., "Optimization of a reverse-offset printing process and its application to a metal mesh touch screen sensor," Microelectronic Engineering, Vol. 134, pp. 1-6, 2015.   DOI
16 Zhang, Y., Wang, S., Li, X., Fan, J. A., Xu, S., Song, Y. M., Choi, K., Yeo, W., Lee, W., Nazaar,, S. N., Lu, r. B., Yin, L., Hwang, K., Roger, J. A. and Huang, Y., "Experimental and theoretical studies of serpentine microstructures bonded to prestrained elastomers for stretchable electronics," Advanced Functional Materials, Vol. 24, No. 14, pp. 2028-2037, 2014.   DOI
17 Ramakrishnan, R., Saran, N., and Petcavich, R. J. "Selective inkjet printing of conductors for displays and flexible printed electronics," Journal of Display Technology, Vol. 7, No. 6, pp. 344-347, 2011.   DOI
18 Subramanian, V., Chang, P. C., Lee, J. B., Molesa, S. E., and Volkman, S. K., "Printed organic transistors for ultra-low-cost RFID applications," IEEE transactions on components and packaging technologies, Vol. 28, No. 4, pp. 742-747, 2005.   DOI
19 Lee, S. K., Young, C. O. and Kim, J. H., "Fused Deposition Modeling 3D Printing-based Flexible Bending Sensor," Journal of the Korean Society of Manufacturing Process Engineers, Vol 19, No. 1, pp. 63-71, 2020.   DOI
20 Im, Y. G, Cho, B. H., Chung S. I. and Jeong, H. D., "Development of Build-up Printed Circuit Board Manufacturing Process Using Functional Prototype Fabrication Technology," Journal of the Korean Society of Manufacturing Process Engineers, Vol. 2, No. 2, pp. 14-21, 2003.
21 Abbel, R., Galagan, Y., and Groen, P., "Roll-to-Roll Fabrication of Solution Processed Electronics," Advanced Engineering Materials, Vol. 20, No. 8, pp. 1701190, 2018.   DOI
22 Choi, N., Wee, H., Nam, S., Lavelle, J., and Hatalis, M., "A modified offset roll printing for thin film transistor applications," Microelectronic engineering, Vol. 91, pp. 93-97, 2012.   DOI