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A Study on the Improvement of Double Injection-molding Keypad Process  

Hong, Min-Sung (아주대학교 기계공학부)
Lee, Ji-Hoon (아주대학교 대학원 기계공학과)
Shin, Soo-Hyun (아주대학교 산업대학원 기계공학과)
Publication Information
Journal of the Korean Society of Manufacturing Technology Engineers / v.20, no.5, 2011 , pp. 659-665 More about this Journal
Abstract
Recently, the plastic resin such as PC, ABS are widely used in IT market. Especially, in most cases the keypads mounted on the mobile phone are the dual-injection-plated type. Environmental regulation is based on the quality of injection-molded products and the minimum process steps are required to avoid the plating defects. Various parameters to produce the injection-molded plastic products make it difficult to obtain the desired stability. However, the past experience and the use of CAE analysis make it possible to predict the problems occurred in injection molding process. Especially, the problems of the weld lines such as runner balancing, bending, deformation and forming defects can be solved systematically and minimized by CAE analysis. Through this study, the non-uniform volumetric shrinkage and the difference in temperature distribution induce the deformation and the high value of stress causes the problems such as crack.
Keywords
Double injection-molding; Weld line; Injection pressure; Strain;
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