1 |
C. S. Smith, "Piezoresistance Effects in Germanium and Silicon," Physical Review, Vol. 94 (1), 42-49, 1954.
DOI
|
2 |
C.-H. Cho, R. C. Jaeger, J. C. Suhling, Y. Kang and A. Mian, "Characterization of the Temperature Dependence of the Pressure Coefficients of n- and p-type Silicon Using Hydrostatic Testing," IEEE Sensors Journal, vol. 8(4), 392-400, 2008.
DOI
|
3 |
J. C. Suhling and R. C. Jaeger, "Silicon piezoresistive stress sensors and their application in electronic packaging", IEEE Sensors Journal, Vol. 1, no. 1, pp. 14-30, 2001.
DOI
|
4 |
A. Mian, J. C. Suhling and R. C. Jaeger, "The van der Pauw stress sensors," IEEE Sensors Journal, Vol. 6, no. 2, pp. 340-356, 2006.
DOI
|
5 |
C.-H Cho and H.-Y Cha, "Stress-Sensors with High-Sensitivity Using the Combined Meandering-Patterns," JSTS, Vol. 15(1), pp. 1-6, 2015.
DOI
|
6 |
C.-H Cho, R. C. Jaeger and J. C. Suhling, "Characterization of the Temperature Dependence of the Piezoresistive Coefficients of Silicon From - to ," IEEE Sensors Journal, Vol.8(8), 1455-, 2008.
DOI
|
7 |
C.-H Cho, Ginkyu Choi and H.-Y Cha, "Strain Effects in van der Pauw (VDP) Stress Sensor Fabricated on (111) Silicon, " IEICE Transactions on Electronics, Vol. E93(5), 640-643, 2010.
|