Current Technologies and Prospects of Electromagnetic Wave Absorbers |
Kim, Dong Il
(Department of Radio Sciences & Engineering, Korea Maritime and Ocean University)
Kim, Soo Jeong (Department of Radio Sciences & Engineering, Korea Maritime and Ocean University) Kwak, Hyun Soo (Department of Radio Sciences & Engineering, Korea Maritime and Ocean University) Joo, Yang Ick (Division of Electrical and Electronics Engineering, Korea Maritime and Ocean University) |
1 | J. M. Song, D. I. Kim, S. J. Shin, S. H. Moon, J. H. Choi, and J. H. Jeung, "Microwave absorbers prepared with Alnico magnets," International Journal of Navigation and Port Research, vol. 29, no. 2, pp. 147-150, Mar. 2005. DOI ScienceOn |
2 | M. Hanazawa, O. Hashimoto, and K. Wada, "New wave absorber using resistive film for ETC system," in Proceedings of International Symposium on Electromagnetic Compatibility (EMC Europe 2002), Sorrento, Italy, pp. 703-705, 2002. |
3 | D. I. Kim, S. J. Kim, and J. M. Song, "Dependence of preparation temperature of the microwave absorption properties in absorbers for mobile phones," Journal of the Korean Physical Society, vol. 43, no. 2, pp. 269-272, Aug. 2003. |
4 | D. H. Kim, D. I. Kim, C. M. Choi, and J. Y. Son, "A study on design and fabrication of complex type EM wave absorber with super wide-band characteristics," International Journal of Navigation and Port Research, vol. 30, no. 2, pp. 161-166, Mar. 2006. DOI ScienceOn |
5 | D. I. Kim, J. Y. Son, W. K. Park, and D. H. Choi, "Broad-band design of ferrite one-body EM wave absorbers for an anechoic chamber," Journal of the Korea Electromagnetic Engineering Society, vol. 4, no. 2, pp. 51-55, Jun. 2004. |
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9 | R. Li, D. I. Kim, and C. M. Choi, "Compact structure with three attenuation poles for improving stopband characteristics," IEEE Microwave and Wireless Components Letters, vol. 16, no. 12, pp. 663-665, Dec. 2006. DOI ScienceOn |
10 | S. Shahparnia and O. M. Ramahi, "Electromagnetic interference (EMI) reduction from printed circuit board (PCB) using electromagnetic bandgap structure," IEEE Transactions on Electromagnetic Compatibility, vol. 46, no. 4, pp. 580-587, Nov. 2004. DOI ScienceOn |