Ultrasonic Bonding Technology for Flip Chip Packaging |
Koo, Ja-Myeong
(성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단)
Kim, Jong-Woong (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단) Yoon, Jeong-Won (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단) Noh, Bo-In (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단) Lee, Chang-Yong (성균관대학교 신소재공학과) Moon, Jeong-Hoon (수원과학대학 기계과) Yoo, Choong-Don (KAIST 기계공학과) Jung, Seung-Boo (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단) |
1 | K. Tanida, M. Umemoto, Y. Tomita, M. Tago, R. Kajiwara, Y. Akiyama and K. Takahashi: Au Bump Interconnection with Ultrasonic Flip-Chip Bonding in 20 m Pitch, Japanese Journal of Applied Physics, 42 (2003) 2198 DOI |
2 | O.V. Abramov: High-Intensity Ultrasonics Theory and Industrial Applications, Gordon and Breach Science Publishers, 1998, 587-684 |
3 | Q. Tan, W. Zhang, B. Schaible and L.J. Bond: Thermosonic Flip-Chip Bonding Using Longitudinal Ultrasonic Vibration, IEEE Transactions on Components, Packaging and Manufacturing Technology-Part B, 21 (1998) 53-58 DOI ScienceOn |
4 | J.M. Koo, J.H. Moon and S.B. Jung, Ultrasonic Bonding of Au Flip Chip Bump for CMOS Image Sensor, Journal of Microelectronics & Packaging Society, 14 (2007) 19 (in Korean) 과학기술학회마을 |
5 | Materials & Components Roadmap RFP Report, Korea Industrial Technology Foundation (2007. 03.) (in Korean) |
6 | 조용호: COG (Chip On Glass) Packaging Trend, 전자정보센터 (http://www.eic.re.kr), (2006) (in Korean) |
7 | J.M. Koo, Y.N. Kim, J.W. Yoon, S.S. Ha and S.B. Jung: Reliability of Nickel Flip Chip Bumps with a Tin-Silver Encapsulation on a Copper/Tin-Silver Substrate during the Bonding Process, Microelectronic Engineering, 84 (2007) 2686-2690 DOI ScienceOn |
8 | J.W. Yoon, W.C. Moon and S.B. Jung: Core technology of electronic packaging, Journal of KWS, 23-2 (2005), 116-123 (in Korean) 과학기술학회마을 |
9 | 유영준: Automotive Electronics의 현황과 전망, 전자정보센터 (http://www.eic.re.kr), (2006) (in Korean) |
10 | J.M. Koo, Y.N. Kim, J.B. Lee, J.W. Kim, S.S. Ha, S.H. Won, S.J. Suh, M.S. Shin, P.W. Cheon, J.J. Lee and S.B. Jung: Ultrasonic Bonding of Au Stud Flip Chip Bump on Flexible Printed Circuit Board, Journal of the Microelectronics & Packaging Society, 14-4 (2007) 79-85 (in Korean) 과학기술학회마을 |
11 | J.M. Koo, J.L. Jo, J.B. Lee, Y.N. Kim, J.W. Kim, B.I. Noh, J.H. Moon, D.U. Kim and S.B. Jung: Effect of Atmospheric Pressure Plasma Treatment on Transverse Ultrasonic Bonding of Gold Flip Chip Bump on Glass Substrate, Japanese Journal of Applied Physics, In-Press |
12 | J.M. Koo, J.W. Yoon, J.H. Moon and S.B. Jung: Effect of Bonding Parameters on Ultrasonic Flip Chip Bonding of Au-to-Cu Interconnection, International Congress on Ultrasonics (2007) 225 |
13 | 홍성제: 디스플레이용 소재 기술동향 (이방성 전도 필름), 전자정보센터 (http://www.eic.re.kr), (2005) (in Korean) |
14 | H. Maruo, Y. Seki and Y. Unami: Development of Ultrasonic Flip Chip Bonding for Flexible Printed Cuicuit, Proceeding of HDP'04 (2004) 307 |
15 | J.W. Yoon, J.W. Kim, J.M. Koo, S.S. Ha, B.I. Noh, W.C. Moon. J.H. Moon and S.B. Jung: Flip-chip technology and reliability of electronic packaging, Journal of KWS, 25-2 (2007), 108-117 (in Korean) 과학기술학회마을 DOI ScienceOn |