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http://dx.doi.org/10.5781/KWJS.2008.26.1.031

Ultrasonic Bonding Technology for Flip Chip Packaging  

Koo, Ja-Myeong (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단)
Kim, Jong-Woong (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단)
Yoon, Jeong-Won (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단)
Noh, Bo-In (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단)
Lee, Chang-Yong (성균관대학교 신소재공학과)
Moon, Jeong-Hoon (수원과학대학 기계과)
Yoo, Choong-Don (KAIST 기계공학과)
Jung, Seung-Boo (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단)
Publication Information
Journal of Welding and Joining / v.26, no.1, 2008 , pp. 31-36 More about this Journal
Keywords
Citations & Related Records
Times Cited By KSCI : 4  (Citation Analysis)
연도 인용수 순위
1 K. Tanida, M. Umemoto, Y. Tomita, M. Tago, R. Kajiwara, Y. Akiyama and K. Takahashi: Au Bump Interconnection with Ultrasonic Flip-Chip Bonding in 20 $\mu$m Pitch, Japanese Journal of Applied Physics, 42 (2003) 2198   DOI
2 O.V. Abramov: High-Intensity Ultrasonics Theory and Industrial Applications, Gordon and Breach Science Publishers, 1998, 587-684
3 Q. Tan, W. Zhang, B. Schaible and L.J. Bond: Thermosonic Flip-Chip Bonding Using Longitudinal Ultrasonic Vibration, IEEE Transactions on Components, Packaging and Manufacturing Technology-Part B, 21 (1998) 53-58   DOI   ScienceOn
4 J.M. Koo, J.H. Moon and S.B. Jung, Ultrasonic Bonding of Au Flip Chip Bump for CMOS Image Sensor, Journal of Microelectronics & Packaging Society, 14 (2007) 19 (in Korean)   과학기술학회마을
5 Materials & Components Roadmap RFP Report, Korea Industrial Technology Foundation (2007. 03.) (in Korean)
6 조용호: COG (Chip On Glass) Packaging Trend, 전자정보센터 (http://www.eic.re.kr), (2006) (in Korean)
7 J.M. Koo, Y.N. Kim, J.W. Yoon, S.S. Ha and S.B. Jung: Reliability of Nickel Flip Chip Bumps with a Tin-Silver Encapsulation on a Copper/Tin-Silver Substrate during the Bonding Process, Microelectronic Engineering, 84 (2007) 2686-2690   DOI   ScienceOn
8 J.W. Yoon, W.C. Moon and S.B. Jung: Core technology of electronic packaging, Journal of KWS, 23-2 (2005), 116-123 (in Korean)   과학기술학회마을
9 유영준: Automotive Electronics의 현황과 전망, 전자정보센터 (http://www.eic.re.kr), (2006) (in Korean)
10 J.M. Koo, Y.N. Kim, J.B. Lee, J.W. Kim, S.S. Ha, S.H. Won, S.J. Suh, M.S. Shin, P.W. Cheon, J.J. Lee and S.B. Jung: Ultrasonic Bonding of Au Stud Flip Chip Bump on Flexible Printed Circuit Board, Journal of the Microelectronics & Packaging Society, 14-4 (2007) 79-85 (in Korean)   과학기술학회마을
11 J.M. Koo, J.L. Jo, J.B. Lee, Y.N. Kim, J.W. Kim, B.I. Noh, J.H. Moon, D.U. Kim and S.B. Jung: Effect of Atmospheric Pressure Plasma Treatment on Transverse Ultrasonic Bonding of Gold Flip Chip Bump on Glass Substrate, Japanese Journal of Applied Physics, In-Press
12 J.M. Koo, J.W. Yoon, J.H. Moon and S.B. Jung: Effect of Bonding Parameters on Ultrasonic Flip Chip Bonding of Au-to-Cu Interconnection, International Congress on Ultrasonics (2007) 225
13 홍성제: 디스플레이용 소재 기술동향 (이방성 전도 필름), 전자정보센터 (http://www.eic.re.kr), (2005) (in Korean)
14 H. Maruo, Y. Seki and Y. Unami: Development of Ultrasonic Flip Chip Bonding for Flexible Printed Cuicuit, Proceeding of HDP'04 (2004) 307
15 J.W. Yoon, J.W. Kim, J.M. Koo, S.S. Ha, B.I. Noh, W.C. Moon. J.H. Moon and S.B. Jung: Flip-chip technology and reliability of electronic packaging, Journal of KWS, 25-2 (2007), 108-117 (in Korean)   과학기술학회마을   DOI   ScienceOn