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| 1 |
Design of Ultrasonic Welding Horn
Yoo, Choong-D.;
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The Korean Welding and Joining Society
, v.26, no.1, pp.9-11,
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| 2 |
Ultra-Thinned Si Wafer Processing for Wafer Level 3D Packaging
Choi, Mi-Kyeung;Kim, Eun-Kyung;
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The Korean Welding and Joining Society
, v.26, no.1, pp.12-16,
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| 3 |
Electrical Characterization of Electronic Package
Kim, Jong-Woong;Koo, Ja-Myeong;Yoon, Jeong-Won;Noh, Bo-In;Jung, Seung-Boo;
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The Korean Welding and Joining Society
, v.26, no.1, pp.17-23,
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| 4 |
Solder Bumping for Flip Chip Bonding
Jung, Jae-Pil;Lee, Hee-Yul;Cheon, Ji-Hun;
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The Korean Welding and Joining Society
, v.26, no.1, pp.24-30,
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| 5 |
Ultrasonic Bonding Technology for Flip Chip Packaging
Koo, Ja-Myeong;Kim, Jong-Woong;Yoon, Jeong-Won;Noh, Bo-In;Lee, Chang-Yong;Moon, Jeong-Hoon;Yoo, Choong-Don;Jung, Seung-Boo;
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The Korean Welding and Joining Society
, v.26, no.1, pp.31-36,
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| 6 |
Au-Sn Flip-chip Bumping Technology and Reliability for Optoelectronic Packaging
Yoon, Jeong-Won;Kim, Jong-Woong;Koo, Ja-Myeong;Noh, Bo-In;Jung, Seung-Boo;
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The Korean Welding and Joining Society
, v.26, no.1, pp.37-43,
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| 7 |
High-Density Electronic Packaging Technology using Anisotropic Conductive Adhesives
Lee, Jin-Woon;Lee, Seong-Hyuk;Kim, Jong-Min;
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The Korean Welding and Joining Society
, v.26, no.1, pp.44-49,
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| 8 |
A Characteristics of the Multiple Repair Welding HAZs in a Low Alloy-Steel(2.25Cr-1.0Mo)
Lee, Chul-Ku;Ahn, Jong-Seok;Lee, Nam-Hyuck;Lee, Gil-Jae;
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The Korean Welding and Joining Society
, v.26, no.1, pp.50-55,
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| 9 |
A Study on the Adhesive Characteristics of Nano Scale Particles Considering Asperity Interaction
Lee, Chang-Hun;Lee, Kyong-Hun;Yoon, Jun-Ho;Shin, Young-Eui;
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The Korean Welding and Joining Society
, v.26, no.1, pp.56-62,
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| 10 |
Study on the Optimization of Pulse GTAW Process for Diaphragm with Thin Thickness
Park, Hyoung-Jin;Hwang, In-Sung;Kang, Mun-Jin;Rhee, Se-Hun;
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The Korean Welding and Joining Society
, v.26, no.1, pp.63-68,
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| 11 |
Effects of Nd:YAG Laser Welding Parameters on Fatigue life of Lap Joint Structure in Stainless Steel
Kim, Yang;Yang, Hyun-Seok;Park, Ki-Young;Lee, Kyoung-Don;
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The Korean Welding and Joining Society
, v.26, no.1, pp.69-75,
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| 12 |
Precipitation and Precipitate Coarsening Behavior According to Nb Addition in the Weld HAZ of a Ti-containing Steel
Moon, Joon-Oh;Lee, Chang-Hee;
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The Korean Welding and Joining Society
, v.26, no.1, pp.76-82,
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