Browse > Article
http://dx.doi.org/10.5781/KWJS.2008.26.1.024

Solder Bumping for Flip Chip Bonding  

Jung, Jae-Pil (서울시립대학교 신소재공학과)
Lee, Hee-Yul (서울시립대학교 신소재공학과)
Cheon, Ji-Hun (서울시립대학교 신소재공학과)
Publication Information
Journal of Welding and Joining / v.26, no.1, 2008 , pp. 24-30 More about this Journal
Keywords
Citations & Related Records
연도 인용수 순위
  • Reference
1 K. Shimokawa, E. Hashino, Y. Ohzelu, K. Tatsumi, 'Micro-ball Bump for Flip Chip Interconnections', IEEE 1998 Electronic Components and Technology Conference
2 Hong, S. M., Kang, C.S., Jung, J. P, Plasma Reflow Bumping of Sn-3.5 Ag Solder for Flux-Free Flip Chip Package Application. IEEE Transactions on Advanced Packaging, 27-1, (2004), 90-96   DOI   ScienceOn
3 SW Jung, JP Jung, Y Zhou, Characteristics of Sn-Cu Solder Bump Formed by Electroplating for Flip Chip ; IEEE Transactions on Electronics Packaging Manufacturing, 29-1,10-16
4 정재필, 초음파를 이용한 환경친화적 Solderless 초소형 flip chip 범프제조, 2006-2008, 아이셀론-산자부
5 畑田 賢造, 범프기술의 개요, 實裝技術 2001, No. 12
6 Sci-Tech Encyclopedia, McGraw-Hill Encyclopedia of Sci. and Tech., 5th ed., McGraw-Hill
7 S. Alsarawi, D. Abbott, P. Franzon, 'A Review of 3-D Packaging Technology', IEEE Transactions on Components Packaging and Manufacturing Technology, part B, 21-1, (1998)
8 정재필, 전주선, '초음파를 이용한 고품질 무연솔더 분말 및 무연 크림솔더 개발', 산업자원부 연구보고서(2003)
9 www.flipchips.com/tutorial
10 J Lee, JP Jung, CS Cheon, Y Zhou, M Mayer, Flip Chip Bump Formation of Sn-1.8 Bi-0.8 Cu-0.6 In, Material Transactions, 46-11 (2005) 2359-2365   DOI   ScienceOn
11 박재현,정재필,정승부, 솔더볼 신뢰성 표준화 연구, 2008, 기술표준원
12 R. Kay, E. Gourcuff, M. Desmulliez, L. Crescent, Stencil Printing Technology for Wafer Level Bumping at Sub-100 Micron Pitch using Pb-Free Alloys', 2005 Electronic Components and Technology Conference_