Browse > Article

The Mixing Ratio Effect of Insert Metal Powder and Insert Brazing Powder on Microstructure of the Region Brazed on DS Ni Base Super Alloy  

Ye Chang-Ho (Dept. of material Science and Engineering, Pusan University)
Lee Bong-Keun (Dept. of material Science and Engineering, Pusan University)
Song Woo-Young (Dept. of material Science and Engineering, Pusan University)
Oh In-Seok (Material Engineering, Chungnam University, Samsung Techwin. Co, LTD.)
Kang Chung-Yun (Dept. of material Science and Engineering, Pusan University)
Publication Information
Journal of Welding and Joining / v.23, no.6, 2005 , pp. 99-105 More about this Journal
Abstract
The mixing ratio effect of the GTD-111(base metal) powder and the GNI-3 (Ni-l4Cr-9.5Co-3.5Al-2.5B) powder on TLP(Transient Liquid Phase) bonding phenomena and mechanism was investigated. At the mixing ratio of the base metal powder under $50wt\%$, the base metal powders fully melted at the initial time and a large amount of the base metal near the bonded interlayer was dissolved by liquid inter metal. Liquid insert metal was eliminated by isothermal solidification which was controlled by the diffusion of B into the base metal. The solid phases in the bonded interlayer grew epitaxially from the base metal near the bonded interlayer inward the insert metal during the isothermal solidification. The number of grain boundaries farmed at the bonded interlayer corresponded with those of base metal. At the mixing ratio above $60wt\%$, the base metal powder melted only at the surface of the powder and the amount of the base metal dissolution was also less at the initial time. Nuclear of solids firmed not only from the base metal near the bonded interlayer but also from the remained base metal powder in the bonded interlayer. Finally, the polycrystal in the bonded interlayer was formed when the isothermal solidification finished. When the isothermal solidification was finished, the contents of the elements in the boned interlayer were approximately equal to those of the base metal. Cr-W borides and Cr-W-Ta-Ti borides formed in the base metal near the bonded interlayer. And these borides decreased with the increasing of holding time.
Keywords
Transient liquid phase bonding; Directionally solidified Ni base superalloy; GID-111; Exitaxial growth; Powder; Microstructrue; Isothermal solidification;
Citations & Related Records
연도 인용수 순위
  • Reference
1 Chung-Yun Kang, Hyong-Chol Whang, In-Bae Kim, Dae-Up Kim, In-Su Woo : Journal of KWS, 21-2(2003), pp.219-226 (in Korea)
2 C.Y. Su, C.P. Chou, W.J. Chang, M.H. Liu : JMEPEG (ASM International), 9(2000), 663-668   DOI   ScienceOn
3 C. Y. Kang, W. Y. Kim : Journal of the Korean Institute of Metals and Materials, 32-11 (1994), pp1348
4 Chung-Yun Kang, In-Bae Kim, Dae-Up Kim, In-Su Woo, Min-Suk Kwon : Journal of KWS, 21-2(2003), 211-218 (in Korea)
5 H.Kokawa, C.H. Lee, T.H. North : Metallurgical Transactions A, 22A(1991), pp. 1627-1631
6 J.A.DAleo and J.R.Wilson : J of Engineering for Gas Turbine and Power, 120 (1998), April, pp375   DOI   ScienceOn
7 Chung-Yun Kang, Hyong-Chol Whang, In-Bae Kim, Dae-Up Kim, In-Su Woo : Journal of KWS, 21-3 (2003), 334-340
8 V. Randle : Microstexture Determination and Its Appication, Inst. Mat. Bourne Press, Bournemouth, Great Britain (1992)
9 DVS : Brazing High Temperature Brazing and Diffusion Bonding, 5th International Conference (1988.6), Achen, 192
10 K.B.Gove : Joining Technology, (1989), June, pp341