Prediction of Residual Stress Caused by IML Process and Deformation Due to Thermal Impact
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Lee, Jae-Won
(Dept. of Mechanical Engineering, Hongik Univ.)
Jang, Eu-Gene (Dept. of Mechanical and System Engineering, Hongik Univ.) Shin, Seung-Won (Dept. of Mechanical and System Engineering, Hongik Univ.) Park, Seung-Ho (Dept. of Mechanical and System Engineering, Hongik Univ.) Chung, Ha-Seung (Dept. of Mechanical and System Engineering, Hongik Univ.) |
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