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http://dx.doi.org/10.3795/KSME-A.2010.34.3.375

Prediction of Residual Stress Caused by IML Process and Deformation Due to Thermal Impact  

Lee, Jae-Won (Dept. of Mechanical Engineering, Hongik Univ.)
Jang, Eu-Gene (Dept. of Mechanical and System Engineering, Hongik Univ.)
Shin, Seung-Won (Dept. of Mechanical and System Engineering, Hongik Univ.)
Park, Seung-Ho (Dept. of Mechanical and System Engineering, Hongik Univ.)
Chung, Ha-Seung (Dept. of Mechanical and System Engineering, Hongik Univ.)
Publication Information
Transactions of the Korean Society of Mechanical Engineers A / v.34, no.3, 2010 , pp. 375-382 More about this Journal
Abstract
In this study, we developed a method to predict the residual stress distribution and thermal deformation caused by in-mold labeling (IML) processes. IML is one of the injection molding processes for injecting a material into a cavity and subsequently inserting a decorated film. The IML process can yield products with decorations of outstanding excellent quality in only one working step. Although the IML process has various advantages, it causes defects such as film delamination, wash-out, and flow marks. In particular, deformation is considered to be a major concern in terms of delamination. To validate the model, the deformation predicted by using a numerical model was compared with experimental results, and both results showed good agreement. We verified that the developed method can be used to obtain the design guidelines for preventing delamination in the initial design stage of the IML process.
Keywords
In-mold Labeling(IML); Film Delamination; Injection Molding; Thermal Impact; Residual Stress;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
Times Cited By SCOPUS : 1
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