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http://dx.doi.org/10.3795/KSME-A.2002.26.11.2436

finite Element Modeling of a Hemispherical Asperity Adhesively Contacting the Plane Surface of Semi-Infinite Rigid Body  

Cho, Sung-San (홍익대학교 기계시스템디자인공학과)
Park, Seung-Ho (홍익대학교 기계시스템)
Publication Information
Transactions of the Korean Society of Mechanical Engineers A / v.26, no.11, 2002 , pp. 2436-2441 More about this Journal
Abstract
Finite element technique considering adhesive forces is proposed and applied to analyze the behavior of elastic hemispherical asperity adhesively contacting the plane surface of semi -infinite rigid body. It is demonstrated that the finite element model simulates interfacial phenomena such as jump -to-contact and adhesion hysteresis that cannot be simulated with the currently available adhesive contact continuum models. This simulation aiso provides valuable information on contact pressure, contact region and stress distributions. This technique is anticipated to be utilized in designing a low-adhesion surface profile for MEMS/NEMS applications since various contact geometries can be analyzed with this technique.
Keywords
Adhesive Contact; Finite Element Analysis; Friction; Adhesion Hysteresis; Lennard-Jones Potential;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
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